According to GIR (Global Info Research), in terms of revenue, the global DPC ceramic substrate revenue will be approximately 259.4 million USD in 2022, and is expected to reach 346.9 million USD in 2029, with a CAGR of 4.2% between 2023 and 2029. In this article, we have summarized the top 15 DIP ceramic substrates manufacturers in China.
TOP 15 DIP ceramic substrates manufacturers in China
Headquarters : Taipei, Taiwan
Established time: 1974
Website: https://www.theil.com/en
TONG HSING ELECTRONIC IND., LTD. was established in 1974 in Taiwan. With its expertise in the development and production of thick film substrates and customized semiconductor micro-module packaging, TONG HSING is dedicated to research and development, process optimization and the provision of customer satisfaction.
Besides, TONG HSING provides wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection and finished module testing services for image sensor, MEMS and biomedical inspection products.
Headquarters : Taoyuan, Taiwan
Established time: 2009
Website: http://www.icprotect.com.tw/index-en.html
Established in 2009 and located in Taoyuan, ICP is dedicated to apply the thin film & lithography process on Alumina/Aluminium Nitride substrate to make passive and circuit components. With both circuit design and processing capabilities, ICP can offer OEM/ODM manufacturing service for products with circuits on ceramic substrate.
Headquarters : Taoyuan, Taiwan
Established time: 2011
Website: https://eng.ecocera.com.tw/
Established in 2011, ECOCERA is currently located in Taoyuan, Taiwan. Its main business is the production of ceramic heat dissipation substrates and the integration and design of ceramic PCB manufacturing. Its products are used in LED lighting, automotive lighting, mobile phone LED flashlights, UV, display and other applications.
Headquarters : Hukou, Taiwan
Established time: 2007
Website: http://en.tensky.com.tw/
Tensky International (Technology) Co., Ltd. mainly supply all kinds of electronic products and precision ceramic products, ceramic and fine porcelain.
Electronic ceramic: LED heat ceramic circuit board (substrate), LED aluminum oxide thin film circuit board (substrate), LED COB ceramic circuit board (substrate), LED ceramic modular circuit board (substrate), LED high thermal conductivity aluminum nitride thin films circuit board (board), flip chip package substrate design and manufacturing, thin film / thick / electroplating / electroless plating process design and process integration
Headquarters : Tongling, Anhui
Established time: 2017
Website: http://en.ceratron.com/
Ceratron Electric (Tongling) Co.,Ltd. is a high-tech enterprise invested by Beida Jade Bird Semiconductor (Tongling) Industry Fund. The product direction covers five major fields, such as power devices and communication substrates, mobile application module substrates, automotive electronic substrates, laser chip packaging substrates, and LED package substrates.
Headquarters : Dongtai, Jiangsu
Established time: 2018
Website: http://www.ftpowersemi.com/
Established in 2018, Ferrotec Semiconductor Technology is held by Shanghai Shenhe Investment Co., Ltd. It is an advanced manufacturing company specializing in R&D, manufacturing and sales of power semiconductor copper-clad ceramic substrates (AMB, DCB, DPC, DBA) and substrate production supply chain materials.
Also read: What is copper clad laminate, types, and functions in PCB?
Headquarters : Wuhan, Hubei
Established time: 2016
Website: https://en.folysky.com/
R&F Tiansheng Technology (Wuhan) Co., Ltd. is a high-tech enterprise specializing in the R&D, production and sales of flat and three-dimensional inorganic non-metallic electronic circuits. It owns the brand of Sliton ceramic circuit boards. The company’s main products are ceramic-based circuit boards, such as alumina ceramic substrates, aluminum nitride ceramic substrates, zirconia ceramic substrates, glass, quartz, etc.
Headquarters : Zhuhai, Guangdong
Established time: 2016
Website: http://www.hancipt.com/
Zhuhai Hanci Precision Technology Co., Ltd. is a company specializing in the research and development and production of DPC process ceramic substrates. In ceramic drilling and cutting, ceramic metallization, ceramic thick copper plating and through-hole filling, micro-circuit production and other processes, it has the ability to be in line with international technology.
Headquarters : Meizhou, Guangdong
Established time: 2017
Website: http://www.mzzzdz.com/
Electronic Technology MEIZHOUZHANZHI was established in 2017. It is a national high-tech enterprise focusing on the research and development, production and application of semiconductor ceramic substrates. The ceramic substrates, wafer substrates, and glass substrates produced by Zhanzhi Technology have been exported to Europe, America, Japan, South Korea, and other countries and regions.
Headquarters: Huizhou, Guangdong
Established time: 2020
Website: http://www.semi-xc.com/
Huizhou Xinci Semiconductor founded in 2020, and focuses on the research and development, production, sales and service of precision ceramic circuit products, and provides packaging substrates and packaging solutions for semiconductor packaging.
The company’s self-developed 3D forming DPC ceramic substrate products are based on high thermal conductivity ceramic substrate as the carrier, creatively integrated film metallization, yellow light microimage, vertical interconnection, 3D stacking and other semiconductor core technologies, is the third generation of semiconductor power device packaging.
Headquarters: Yiyang, Hunan
Established time: 2017
Website: http://www.sgmypcb.com/en/
Yiyang Shuguang Muyang Electronic Technology co., LTD,which is located in Changchun Economic and Technological Development Park, Yiyang City, Hunan Province, is a collection of R&D, design and sales of foreign trade in the integration of new semiconductor components and electronic packaging substrate manufacturing high-tech enterprise.
Headquarters: Shenzhen, Guangdong
Established time: 2017
Website: http://yuanxuci.com/En
Shenzhen Yuan Xuci Electronic Technology Co., Ltd. was established in 2017. With years of mastery and application of patented technology of high thermal conductivity materials and the continuous improvement of customer groups’ requirements for performance parameters of thermal conductivity materials, it has become the industry’s first-class thermal conductivity product production and research enterprise.
The company is committed to the research and development, sales and application of ceramic metallized circuit boards.
Headquarters: Shenzhen, Guangdong
Established time: 1994
Website: https://www.bominelec.com/
Bomin Electronics was founded in 1994. The company mainly produces high-end printed circuit board (PCB), and carries out one-stop service around the upstream and downstream integration mode of “PCB+ components + solutions “.
Featured products are mainly HDI board, high multilayer board, microwave high frequency board, thick copper plate, metal base/core board, soft board, soft and hard combined board, ceramic substrate and passive devices, etc.
Headquarters: Dongguan, Guangdong
Established time: 2020
Website: https://www.sino-vio.com/en/
Founded in 2020, SinoVio Semiconductor Technology (Dongguan) Co.Ldt. Is located in the University Innovation Campus of Songshan Lake Area, Dongguan, Guangdong.
SinoVio focuses on the manufacture, research, development, and sales of high power deep ultraviolet light-emitting diode (UVC-LED) and related products, the business covers the upstream AlN substrate preparation, midstream MOCVD epitaxy as well as downstream chip design and device package.
Headquarters: Suzhou, Jiangsu
Established time: 2013
Website: https://www.gyz.com/?l=en-us
Suzhou GYZ Electronic Technology Co., Ltd was founded in 2013, and is located in Kunshan, Jiangsu. It carries out chain operations from design to manufacturing, and provide customers with all types of electronic components, high-precision injection molded parts, insert molding and other high quality products.
DPC Ceramic Substrate is a technology that combines thin-film circuit and electroplating process. It adopts image transfer method to make circuit on thin-film metallized ceramic board, and then uses perforated electroplating technology to form vertical interconnection between high-density double-sided wiring.
1.Using semiconductor micro-processing technology, the metal lines on the ceramic substrate are more refined.
2. The low-temperature preparation process (below 300°C) avoids the adverse effects of high temperature on the substrate material and metal circuit layer, and also reduces the production cost.
- TONG HSING ELECTRONIC
- ICP
- ECOCERA
- Tensky International
- Ceratron Electric (Tongling)
- Ferrotec
- R&F Tiansheng Technology (Wuhan)
- Zhuhai Hanci Precision Technology
- Electronic Technology MEIZHOUZHANZHI
- Huizhou Xinci Semiconductor
- Yiyang Shuguang Muyang Electronic Technology
- Shenzhen Yuan Xuci Electronic Technology
- Bomin Electronics
- SinoVio Semiconductor Technology
- Suzhou GYZ Electronic Technology
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