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Top-10-semiconductor-package-testing-suppliers-in-2023

The scale of the global assembly testing market is growing significantly, and it is expected that the overall scale will exceed 40 billion USD in 2023. The market concentration is relatively obvious. The market share of the top ten manufacturers is about 80%, and the market is mainly occupied by mainland of China and Taiwan of China manufacturers. This passage is to collect the top 10 semiconductor package testing suppliers in 2023.

Table of Contents

JCET

JCET

LocationJiangsu, China
Established time1998-11-06
Company websitehttp://www.jcetglobal.com/

Company profile

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Main products and services

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies.

HT-TECH

HT-tech

Location

Gansu, China

Established time

2003-12-25

Company website

https://www.ht-tech.com/

Company profile

HT-tech was founded on December 25,2003 and IPO on shenzhen stock exchange on November 20,2007(stock code:002185).

Main products and services

Mainly business: semiconductor IC, semiconductor components assembly andtest. HT-tech provides turnkey service for customers, has advanced technical capabilities, system-level production and quality control.

Provide packaged product testing from program development, CP,FT to SLT;
Mainstream and high precision test platform,comprehensive and advanced technology;
Covering all kinds of semiconductor chips in the market,such as the Internet of things,communications,computers,smart phones and consumer products;
To provide customers with professional data collection and analysis services.

TF

TF

Location

Jiangsu, China

Established time

1994-02-04

Company website

https://www.tfme.com/

Company profile

TF was founded in October 1997 and listed in Shenzhen Stock Exchange in August 2007. The total capital stock of the company is 1153.7 million shares.

As the backbone undertaking unit of the National Science and Technology Major Project (” 02 “special project), Tongfu Micro Electronics owns high-level R&D platforms such as the national recognized enterprise Technology Center, national postdoctoral research workstation, Jiangsu Provincial Engineering Technology Research Center and Jiangsu Provincial Key Laboratory of Integrated Circuit Advanced Closed Test.

Main products and services

TFME provide customers with a full range of test platforms and engineering services to support a wide range of analog and mixed signal, automotive, Radio Frequency (RF), high-performance caculated devices, baseband, memory devices, LCD driver devices, SiP devices, power module devices and specific application integrated circuits. With the additional of TF-AMD, our test portfolio includes, CPU, GPU, gaming console and high performance networking products.

LCSP

LCSP

LocationJiangsu, China
Established time2005-06-10
Company websitehttp://www.wlcsp.com/

Company profile

From its beginning in 2005, China Wafer Level CSP Co., Ltd. has focused on developing innovative technologies and assisting its customers in implementing high-volume manufacturing of reliable, miniaturized, high-performance and cost-effective semiconductor CMOS Image Sensor packages.

Main products and services

The company’s main product focus includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.

Chippacking

CPC

LocationGuangdong, China
Established time2006-11-07
Company websitehttp://www.chippacking.com/

Company profile

Chippacking was set up in 2006 in Shenzhen. Based on the research and development and application of integrated circuit packaging and testing technology, it is a state-level high-tech enterprise engaged in integrated circuit packaging and testing and providing packaging technology solutions. The company was listed on the Science and Technology Innovation Board of Shanghai Stock Exchange on June 23, 2021 with stock code 688216.

Main products and services

Chippacking has always focused on delivering more competitive package test products to its customers, reanalyzing DIP, SOP, SOT, DFN/QFN with its deep understanding of DFN/QFN through continuous R&D investment.

ASE

ASE

LocationTaiwan, China
Established time1984
Company websitewww.aseglobal.com

Company profile

ASE Technology Holding is the leading provider of semiconductor manufacturing services in assembly and testing. Its manufacturing locations span the globe, with facilities in Taiwan of China, South Korea, Japan, Singapore, Malaysia, Vietnam, Mexico, the United States, Poland, France, the United Kingdom, Germany, Tunisia, etc.

Main products and services

ASEH develops and offers complete turnkey solutions covering front-end engineering tests, wafer probing, IC packaging and modules, materials, final test, system and board level integration and, electronic design and manufacturing services(EMS).

Powertech

PTI-group

LocationTaiwan, China
Established time1997
Company websitehttps://www.pti.com.tw/en

Company profile

Powertech Technology Inc. (PTI), the world’s leading OSAT, was founded in 1997. PTI has over 18,000 employees world wide, and manufacturing facility located in Taiwan, China, Singapore, and Japan. PTI dedicates her efforts in developing advanced technologies, while carrying on as the world’s leading memory packaging and testing solution provider.

Main products and services

It serves the international customers with services including chip bumping, chip probing, IC assembly, final testing, burn in, and system level assembly.

Amkor Technology

amkor

Location

Arizona, the USA

Established time

1968

Company website

https://amkor.com/

Company profile

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, EMEA and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, it has delivered innovative packaging solutions with the service and capacity global customers rely on.

Main products and services

Amkor’s comprehensive test services complement wafer level and package assembly. In addition, Amkor is the leading RF test services supplier for sub-6 GHz and is engaged in ongoing joint efforts with test equipment suppliers and customers to enable 5G product production testing.

UTAC Holdings

UTAC

Location

Ang Mo Kio, Singapore

Established time

1997

Company website

https://www.utacgroup.com/

Company profile

UTAC Holdings Ltd and its subsidiaries (“UTAC”) is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end uses, including consumer devices, automotive devices, security devices and so on.

Main products and services

UTAC integrates service offerings to provide customers full-turnkey manufacturing solutions, including: bumping, wafer probe, wafer processing, assembly, test, black-box encryption and direct shipment as designated by customers. Additionally, it has established service partners to enhance our value offerings and provide seamless support to customers which include 3D Embedded Substrate Manufacturing and Burn-In.

Unisem

Unisem

LocationBandar Pulai Jaya, Malaysia
Established time1989-06
Company websitehttps://www.unisemgroup.com/

Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies.

Main products and services

Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization.

Conclusion

IBE, with more than 18 years of manufacturing on PCB and PCBA, offers one-stop services for any kinds of PCB. We have professional team and equipments to meet your customerized demands.

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