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top 10 Packaging and Testing Companies in China

Welcome to an exploration of China’s top 10 packaging and testing companies, where innovation, precision, and quality converge to shape the future of the industry. As a global manufacturing powerhouse, China has consistently demonstrated its prowess in developing cutting-edge solutions that cater to the diverse needs of the modern market. From advanced packaging techniques that ensure product integrity to rigorous testing methodologies that guarantee reliability, these companies stand at the forefront of technological advancements. Keep reading!

Table of Contents
Semiconductor Packaging
JCET
JCET

Established time

1998-11-06

Headquarters

Jiangyin, Jiangsu Province

Company website

www.jcetglobal.com

JCET Group is the world’s leading integrated circuits manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Its comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System in Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

Tongfu Microelectronics

Tongfu Microelectronics
Tongfu Microelectronics

Established time

1994-02-04

Headquarters

Nantong, Jiangsu Province

Company website

http://www.tfme.com

Tongfu Microelectronics as a Chinese integrated circuit (IC) encapsulation test service provider provides one-stop design simulation and encapsulation test services for global customers. Tongfu Microelectronics engages in products, technologies and services in many fields, including network communication, mobile terminals, household appliances, AI, auto electronics, etc.

Tongfu Microelectronics headquarters is located in Nantong, Jiangsu Province. Tongfu Microelectronics possesses global manufacture and service bases and has built seven major production bases in Nantong, Hefei, Xiamen, Suzhou and Penang in Malaysia to provide global customers with fast and convenient services. Tongfu Microelectronics has more than 18,000 employees all over the world. Tongfu Microelectronics will cooperate with customers to march towards the objective of becoming a world-class IC encapsulation test enterprise with the support of national policies, market stimulation, drive of the demands of system manufacturers, collaborative development of the industry chain and support of the national industry fund.

HT-tech
HT-tech

Established time

2003-12-25

Headquarters

Tianshui, Gansu Province

Company website

www.ht-tech.com

HT-tech was founded on December 25,2003 and IPO on shenzhen stock exchange on November 20,2007. Mainly business: semiconductor IC, semiconductor components assembly andtest. HT-tech provides turnkey service for customers, has advanced technical capabilities, system-level production and quality control.

CR Micro
CR Micro

Established time

2017-06-30

Headquarters

Shanghai

Company website

https://www.crmicro.com

Being subordinate to China Resources Group, China Resources Microelectronics Limited is a high-tech enterprise engaged in investment, development, operation and management of microelectronics business. The Company always takes “revitalizing microelectronics industry” as our mission and has successively integrated some Chinese semiconductor pioneering companies such as Huake Electronics, China Huajing and CSNC Technology. After several years of development and a series of integration, the Company has become a comprehensive semiconductor enterprise with great influence in China. Since 2004, it has been continuously rated as top 100 Chinese electronic information enterprises by the Ministry of Industry and Information Technology. Based on the statistical data of the China Semiconductor Industry Association, in terms of sales amount, the Company was the only semiconductor enterprise with the main business in IDM mode among the top 10 Chinese semiconductor enterprises in 2018.

The Company is a Chinese leading semiconductor enterprise capable of the integrated operation of the whole industrial chain such as IC design, wafer manufacturing, package testing and so on. At present, Its main business can be divided into two business sectors, which are products & solutions, manufacturing & service. The Company can independently design products and keep the manufacturing process controllable. In addition, the Company has possessed strong capability in product technology and manufacturing process in the fields of discrete devices and integrated circuits and has formed advanced product lines with special processes and seriation.

WLCSP
WLCSP

Established time

2005-06-10

Headquarters

Suzhou, Jiangsu

Company website

http://www.wlcsp.com

In June 2005, Suzhou Jingfang Semiconductor Technology Co., Ltd. is a company dedicated to developing and innovating new technologies to provide customers with reliable, miniaturized, high-performance and cost-effective semiconductor packaging mass production service providers. Wafer-level packaging technology for CMOS image sensors of Wafer Technology has completely changed the packaging world, making high-performance, miniaturized mobile phone camera modules possible. This value has made it the most widely used packaging technology in history. Today, nearly 50% of image sensor chips can use this technology, which is widely used in smart phones, tablet computers, wearable electronics and other electronic products.

Chippacking
Chippacking

Established time

2006-11-07

Headquarters

Shenzhen, Guangdong

Company website

http://www.chippacking.com

Based on the R&D and application of integrated circuit packaging and testing technology, Chippacking is a national high-tech enterprise engaged in integrated circuit packaging and testing, and providing packaging technology solutions.

Since its establishment, Chippacking has been engaged in the packaging and testing services of integrated circuits. After years of precipitation and accumulation, the company has developed into one of the largest domestic integrated circuit packaging and testing enterprises in South China.

Since its establishment, Chippacking has always insisted on driving development with independent innovation, focusing on the research and development and upgrading of integrated circuit packaging and testing technology, and building market competitive advantages through iterative product updates. The company has mastered a number of core technologies such as 5G MIMO base station GaN microwave RF power amplifier plastic packaging technology, high-density large-matrix integrated circuit packaging technology, miniaturized and self-designed packaging solutions with pins, and has formed its own competitive advantage in the field of integrated circuit packaging. , has strong competitive strength in the field of integrated circuit packaging and testing.

Chizhou Hisemi electronics

Chizhou Hisemi electronics

Chizhou Hisemi electronics
Chizhou Hisemi electronics

Established time

2014-10-20

Headquarters

Chizhou, Anhui Province

Company website

http://www.hisemi.com.cn

Chizhou Hisemi Electronic Technology Co., LTD was established in October 2014. Is a high-end electronic information manufacturing enterprise focusing on integrated circuit packaging and testing business, including integrated circuit packaging, wafer testing services, chip finished product testing services. In the field of packaging, it has core technologies such as MULTI-chip module (MCM) package, THREE-DIMENSIONAL (3D) stack package, miniaturized flat pin less (QFN/DFN) package, high-density micro-spacing integrated circuit package, etc. A number of independent core technologies have been formed in the testing field. The sizes of test wafers cover 12 “, 8 “, 6 “, 5 “, 4 “and other sizes, including 22nm, 28nm and above wafer manufacturing processes. In terms of chip testing, the company has developed more than 30 kinds of chip testing solutions, such as MCU chip, ADC chip, FPGA chip, GPU chip, video chip, RF chip, SoC chip and digital signal processing chip.

The company’s independent research and development of 3D ribbon machine, fingerprint identification and sorting equipment, gravity testing and knitting machine and other equipment, has been matured use in the actual production practice. Products are widely used in 5G communications, automotive electronics, industrial control and consumer products, smart home, smart positioning, information security, fire safety, smart wear and other industries.

Foshan Blue Rocket Electronics

Foshan Blue Rocket Electronics
Foshan Blue Rocket Electronics

Established time

1998-12-30

Headquarters

Foshan, Guangdong Province

Company website

http://www.fsbrec.com

Foshan Blue Rocket Electronics Co., Ltd. which is a Guangdong High-Tech Enterprise is professional in researching, developing and manufacturing of semiconductor devices in China. Its former is No.4 Electronics Factory of Foshan which was founded in the early 1970s. In 1998 it transformed into a limited liability company and renamed FOSHAN BLUE ROCKET ELECTRONICS CO., LTD. by finishing share reform in 2012. Now its annual capacity reaches 15 billion pieces. It is one of the main manufacturing bases of semiconductor devices in South China.

The company is located in Chancheng District of Foshan City. The plant area is 80000 square meters. It owns plenty of advanced production lines. Its product series include all kinds of package devices such as TRANSISTOR, DIODE, IC, MOSFET, SBD, FRD, SCR, etc.. The products are widely used in fields such as electric appliances, power supply, IT digital, communication, new energy, automotive electronics, instruments, LED display screen, LED lighting, and Backlight.

Jiangxi Wan Nian Xin Micro-electronics

Jiangxi Wan Nian Xin Micro-electronics

Jiangxi Wan Nian Xin Micro-electronics
Jiangxi Wan Nian Xin Micro-electronics

Established time

2017-02-13

Headquarters

Shangrao, Jiangxi Province

Company website

www.wnxjx.com

Jiangxi ten thousand core microelectronics co., LTD., founded in February 2017, the project covers an area of 112 mu, total construction area of 117000 square meters, with a total investment of 2 billion yuan, annual output value of 2.5 billion, according to the 2025 China manufacturing core design of the overall planning requirements, the main production of large scale integrated circuit, hybrid integrated circuit, new electronic components and semiconductor material, components, points in the third phase of construction.

Lippxin Microelectronics

Lippxin Microelectronics

Lippxin Microelectronics
Lippxin Microelectronics

Established time

2015-04-08

Headquarters

Suining, Sichuan Province

Company website

www.lipuxin.com

Lippxin Microelectronics was founded in Shenzhen in 2006. Its main business is R&D, design and packaging testing of integrated circuits and power devices. It has been deployed in Shenzhen, Chengdu, Suining, Xiamen, Nantong, Suzhou, Hangzhou, Zhongshan and other places. The products cover DDIC, PMIC, processor, signal chain and power devices, and can provide solutions for various application scenarios in consumer electronics, industrial control, automotive electronics and other fields.

FAQ

Packaging is the process of enclosing the individual semiconductor chip in protective material. Package testing evaluates the integrity of this packaging and checks for any defects introduced during the packaging process.

  1. JCET
  2. Tongfu Microelectronics
  3. HT-tech
  4. CR Micro
  5. WLCSP
  6. Chippacking
  7. Chizhou Hisemi electronics
  8. Foshan Blue Rocket Electronics
  9. Jiangxi Wan Nian Xin Micro-electronics
  10. Lippxin Microelectronics

BCC: Bump chip carrier.
CLCC: Ceramic leadless chip carrier.
LCC: Leaded chip carrier.
LCCC: Leaded ceramic chip carrier.
DLCC: Dual lead-less chip carrier.
PLCC: Plastic-leaded chip carrier.
PoP: Package on Package.

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