The packaging substrate is a circuit board used to carry chips. It belongs to a technical branch of PCB and the core semiconductor packaging and testing material. Characterized by high density, high precision, high performance, miniaturization and thinness, it can provide support, heat dissipation and protection for chips. Besides, it also provides electrical connection and physical support between the chip and the PCB motherboard. In this article, we will share the top 10 package substrate manufacturers in the world.
UMTC
| Location | Taoyuan, Taiwan province of China |
| Establish time | 1990.01.25 |
| Company website | www.unimicron.com |
Company profile
Founded in 1990 and headquartered in Taoyuan, Taiwan, Unimicron is one of the suppliers of circuit boards (PCBs) and integrated circuit carriers (IC Carriers). It has 13 factories in Taiwan, and China and five production bases in mainland China, respectively in Shenzhen(Guangdong), Suzhou(Jiangsu), Kunshan(Jiangsu) and Huangshi(Hubei).
Main products and services
It produces multi-layer (thick) boards, high-density interconnect boards, IC carrier boards, rigid-soft boards, and flexible boards. Product applications include computer computing, network communications consumer products, industrial, automotive, and medical, etc. Besides, its main packaging substrate products are WBCSP, WBBGA, FCCSP, FCBGA, PoP and Hybrid, accounting for 15% of the market share.
Ibiden
| Location | Gifu, Japan |
| Establish time | 1912.11.25. |
| Company website | www.ibiden.com |
Company profile
In the electronics business, Ibiden focuses on plastic packaging, PCBs and related products, while in the ceramics field, Ibiden concentrates on DPF and special carbon products.
Main products and services
Ibiden provides the manufacturing of IC package, printed wiring board, SiC-DPF, the substrate holding mat, graphite specialty, and high-temperature insulation wool.
Latest news
IBIDEN Co., Ltd. (Head Office: Ogaki, Gifu Pref.; President: Takeshi Aoki) is pleased to announce that in August 2022, its production subsidiary IBIDEN Philippines, Inc. (Head Office: Batangas, Philippines) converted its electricity consumption to renewable energy sources.
SEMCO
| Location | Gyeonggi-do, South Korea |
| Establish time | 1973 |
| Company website | www.samsungsem.com |
Company profile
Established in 1973, Samsung Electro-Mechanics has become a remarkable developer and manufacturer of key electronic components not only in Korea but also in other parts of the world.
Main product and services
Since the start of the 2000s, the company has been seeking to further develop strategic technologies and create business synergy based on core technologies of materials, multilayer thin-film molding, and high-frequency circuit design. With this at its core, it is focusing on fostering the business of chip parts, camera modules, communication modules and boards.
Key core technologies: bumping structure and μBall bump method
Substrate types include EPS(Embedded Passive Substrate) & EDS(Embedded Die Substrate) and ETS(Embedded Trace Substrate).
Kinsus
| Location | Taoyuan, Taiwan province of China |
| Establish time | 2000.09 |
| Company website | www.kinsus.com.tw |
Company profile
Kinsus keeps decent growth since established in the year 2000. It was rewarded as a best-growing company for consecutive three years in Common Wealth magazine starting in 2002. The Common Wealth magazine also ranked Kinsus the second best operation performance company among 1000 manufacturing companies in the Taiwan province of China.
A strong supply chain has been established based on good human resources and technology incubation. The semiconductor back-end technology has been migrated from the lead frame into BGA packaging and moving into Flip-chip packaging. Kinsus was established in this environment to provide the industry with competitive solutions and fast time-to-market services.
Main products and services
Kinsus provide services including Sip, PBGA, FCCSP, CSP, RF modules, and FCBGA. Take Sip as an example.
A carrier substrate provides a platform for multiple chips or packages or passive components assembly. The applications include Multi-Chip Module (MCM), Multi-Chip Package (MCP), Stack Die, Package in Package (PiP), and Embedded Substrates. SiP provides integration other than System-on-Chip (SoC). SiP integrates inhomogeneous ICs and other components with a compact profile and faster time-to-market.
NanYaPCB
| Location | Taipei, Taiwan province of China |
| Establish time | 1997.10 |
| Company website | www.nanyapcb.com.tw |
Company profile
Nan Ya PCB Corporation used to be one of the business divisions of Nan Ya Plastics Corporation which is part of Formosa Plastics Group and turned into a subsidiary by 1997 as the manufacturer of Printed Circuit Boards (PCBs) and IC Substrates. On the back of the effort made for 50 years, Formosa Plastics Group held position number 323 on the “Fortune 500” list in 2009.
Main products and services
Manufacturing and sales of Conventional PCB, High-density Interconnection(HDI), Rigid-Flex, ABF (Ajinomoto Build-up Film) Substrate, and PP (Prepreg) Substrate.
Shinko
| Location | Nagano, Japan |
| Establish time | 1946.09.12 |
| Company website | www.shinko.co.jp |
Company profile
SHINKO ELECTRIC INDUSTRIES CO., LTD. has developed a global business that provides total solutions in semiconductor backend processing by applying and advancing a wide range of fundamental technologies for semiconductor packaging that it has cultivated since its founding, in order to contribute to the businesses of customers around the world.
Main products and services
Manufacturing and sales of plastic laminated packages (PLPs), leadframes, glass-to-metal seals, heat spreaders, ceramic electrostatic chucks, IC assembly and assembly of system modules
Simmtech
| Location | Chungcheongbuk-do, South Korea |
| Establish time | 1987 |
| Company website | www.eng.simmtech.com |
Company profile
SIMMTECH has been concentrating on developing and manufacturing high-layer PCBs for semiconductors since it was established in 1987. Through the accumulated world’s best manufacturing competitiveness, SIMMTECH is producing the most advanced PCBs for semiconductor global leaders.
Main products and services
SIMMTECH’s major products are module PCBs for semiconductors’ memory expansion and substrates for semiconductor chip assembly.
As memory module PCB, BOC boards for DRAM package, and Embedded Trace Substrate were awarded “World Class Products” by the Korean Government with the largest market share in the world, SIMMTECH is leading the technology evolution as a core supplier for packaging substrate to Tier-1 semiconductor customers.
Daeduck
| Location | Gyeonggi-do, Korea |
| Establish time | 1965 |
| Company website | www.daeduck.com |
Company profile
DAEDUCK is the First company in Korea that has manufactured printed circuit boards. Daeduck is specialized in printed circuit boards for semiconductors such as CSP, fcCSP, and BOC.DAEDUCK has the best technology for producing ultra-thin package substrates including coreless and automation. Daeduck can handle substrate under 0.04 mm core thickness automatically and result in good quality.
Main products and services
Daeduck provides FCBGA, FCCAP, CSP, SIP, AIP and FCBOC services. Take FCBGA as an example. Its FCBGA substrates are cutting-edge multilayer PCBs applied with the build-up technique and SAP technology, and it provides a basic foundation and electrical connection paths for FCBGA packages.
Kyocera
| Location | Kyoto, Japan |
| Establish time | 1959.04.01 |
| Company website | www.global.kyocera.com |
Company profile
Kyocera Corporation is a Japanese multinational ceramics and electronics manufacturer headquartered in Kyoto, Japan. It was founded as Kyoto Ceramic Company, Limited in 1959 by Kazuo Inamori and renamed in 1982. It manufactures industrial ceramics, solar power generating systems, telecommunications equipment, office document imaging equipment, electronic components, semiconductor packages, cutting tools, and components for medical and dental implant systems.
Main products and services
Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. Kyocera also supplies frit-seal ceramic lids and solder-seal metal lids.
ASE Material
| Location | Kyoto, Japan |
| Establish time | 1984 |
| Company website | https://ase.aseglobal.com/en |
Company profile
ASE has focused on the research and development of substrate technology for low-cost, high-performance, thin, miniature, reliable and environmentally compatible next-generation IC package solutions. ASE’s substrate design and manufacturing capability enable the interconnection materials of a wide range of wire-bond BGA and flip-chip product applications. It also provides stub-less solutions* such as etching back、a-SG (advanced selected gold) and DPS (double pattern sputter) for high-frequency and high-performance package applications.
Main products and services
It produces advanced RDL packaging, system-in-package, traditional IC packaging, etc. For packaging substrate offerings are involving plastic BGA substrate, flip-chip chip scale package substrate, BOC(DDR substrate), low-power DDR substrate, module substrate and so on.
Conclusion
It’s forecasted that the overall PCB industry market will grow by 4.8% from 2021 to 2026, while the packaging substrate is expected to grow from US$14.2 billion in 2021 to US$21.4 billion in 2026, with a compound growth rate of 8.6%, exceeding the overall growth level of the PCB industry. IBE also provides substrate services, any further information can be founded on our website.
