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Top 10 IC packaging companies in China

China’s semiconductor industry has been growing rapidly in recent years, and IC packaging is an important segment of this industry. As such, there are many IC packaging companies in China that provide a wide range of services. In this article, we will highlight the top 10 IC packaging companies in China, let’s take a look at who they are!

Table of Contents
IC Packages

SINO IC Technology

SINO IC Technology

SINO IC Technology
SINO IC Technology

Established time

2001-04-28

Headquarters

Shanghai, China

Company website

http://www.sinoictest.com.cn

Founded in 2001, SINO IC Technology is mainly committed to domestic leading testing technology research, domestic testing equipment development and new method research in professional fields, providing high-quality, cost-effective and comprehensive testing technology solutions for the entire industrial chain for the integrated circuits industry chain.

It has more than 10,000 square meters of testing technology research and development and production testing innovation service base, has a domestic leading 28nm-12nm advanced process product testing line, is equipped with more than 200 sets of international advanced testing equipment, and has established 10-level and 1000-level ultra-high standards Purification test platform. The monthly test capacity of 12-inch wafers exceeds 50,000 pieces.

QIXIN MEMS
QIXIN MEMS

 

Established time

2011-01-26

Headquarters

Zibo, Shandong Province

Company website

http://www.qxmems.com

Shandong QIXIN MEMS Co., Ltd. is mainly engaged in the packaging and testing of IC card chips, the design and manufacture of RFID and MEMS devices, and the provision of intelligent Internet of Things system solutions. Its products are mainly used in the fields of Internet of Things, automation, bank payment, communication, identification, etc., and have broad application prospects. 

At present, it has the production capacity of IC card chip packaging and testing more than 2 billion pieces, customers are distributed all over the world, and its market share ranks in the forefront of the international industry. The overall solution of intelligent logistics and warehouse management system based on RFID and MEMS technology has provided services for many well-known logistics and retail companies around the world.

NST
NST

Established time

2012-05-25

Headquarters

Wuxi, Jiangsu Province  

Company website

http://www.nst-ic.com

Jiangsu NST Technology Co., Ltd. (“NST” for short) is a technologically innovative semiconductor integrated circuit design company. The core backbone of the company comes from well-known European and American manufacturers, including technical elites from chip design and chip manufacturing companies. 

Founded in 2006, the company has established two R&D centers in Wuxi and Shanghai, and a relatively mature market system in Shenzhen. Through several years of technology integration and technology accumulation, NST has completed the design and development of chips in several major fields, and is currently committed to the design and development of multimedia processing chips, MCU micro-control chips, RF radio frequency chips, power drive chips, etc.

Nantong Hualong Microelectronics

Nantong Hualong Microelectronics

Nantong Hualong Microelectronics
Nantong Hualong Microelectronics

Established time

2005-03-22

Headquarters

Nantong, Jiangsu Province

Company website

www.nthualong.cn

Nantong Hualong Microelectronics Co., Ltd. is established on the basis of decades of business technology and management backbone in the China’s packaging and testing industry and has strong process technology and management advantages in semiconductor packaging and testing technology. Products currently engaged in packaging and testing include power transistors, MOSFETs, Schottky diodes, voltage regulator circuits (78 series), Hall ICs, Hall sensors and other products. The product appearances mainly include T092S, T094, T0251, TO-263, TO-3P, TO-247, T0126 series, T0220 series, etc.

Simat Microelectronics Technology

Simat Microelectronics Technology

Simat Microelectronics Technology
Simat Microelectronics Technology

Established time

2007-06-05

Headquarters

Shanghai, China

Company website

www.simat-sh.com

Shanghai Simat Microelectronics Technology Co.,Ltd. is engaged in technology development, technical consultation, technical services, and technology transfer in the field of electronic technology, including the manufacture, processing, wholesale, retail, and testing of electronic components.

The company obtained the German TUV (ISO9001) quality system certification in December 2007, and the German TUV (ISO14001) environmental management system certification in April 2008.

Diantong Wintronic Microelectronics

Diantong Wintronic Microelectronics

Diantong Wintronic Microelectronics
Diantong Wintronic Microelectronics

Established time

2007-02-06

Headquarters

Shenzhen, Guangdong Province

Company website

http://www.szdtwcw.com

Diantong Wintronic Microelectronics is a national high-tech enterprise mainly engaged in the research and development, production and sales of integrated circuit packaging and testing and MEMS pressure sensors.

The company’s main packaging product types include SOP, SSOP, SOT, TSOT, DFN, QFN, MSOP series, and more than 20 packaging specifications. Product functions include: power management, MCU, MOSFET, LED lighting and LED display driver, Bluetooth chip, touch chip, charging chip, power amplifier chip, AI recognition chip, multi-signal recognition chip, low noise amplifier LNA, etc.

JCET Group
JCET Group

Established time

1998-11-06

Headquarters

Jiangyin, Jiangsu Province

Company website

www.jcetglobal.com

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Its comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to its global customers.

China Wafer Level CSP

China Wafer Level CSP

China Wafer Level CSP
China Wafer Level CSP

Established time

2005-06-10

Headquarters

Suzhou, Jiangsu Province

Company website

www.wlcsp.com

China Wafer Level CSP Co., Ltd. was founded in Suzhou in 2005 with a vision on developing innovative technologies and assisting its customers in implementing high-volume manufacturing of reliable, miniaturized, high-performance and cost-effective semiconductor packages. 

China Wafer Level CSP’s CMOS Image Sensor Chip-Scale Package technology revolutionized the packaging world, helping make the high-performance, miniaturized mobile camera modules of today possible. The value of this approach has allowed it to become one of the most widely proliferated packaging technologies in history, finding use with nearly 50% of today’s image sensor chips, and with a wide range of semiconductor devices that are ubiquitous in smartphones, tablets, wearables and other electronics.

HT-tech
HT-tech

Established time

2003-12-25

Headquarters

Tianshui, Gansu Province

Company website

www.ht-tech.com

HT-tech was founded on December 25,2003. Its main business includes: semiconductor IC, semiconductor components assembly andtest. HT-tech provides turnkey service for customers, has advanced technical capabilities, system-level production and quality control.

Tongfu Microelectronics

Tongfu Microelectronics

Tongfu Microelectronics
Tongfu Microelectronics

Established time

1994-02-04

Headquarters

Nantong, Jiangsu Province

Company website

www.tfme.com

Tongfu Microelectronics, as a Chinese integrated circuit (IC) encapsulation test service provider, provides one-stop design simulation and encapsulation test services for global customers. Tongfu Microelectronics engages in products, technologies and services in many fields, including network communication, mobile terminals, household appliances, AI, auto electronics, etc.

Tongfu Microelectronics possesses global manufacture and service bases and has built seven major production bases in Nantong, Hefei, Xiamen, Suzhou and Penang in Malaysia to provide global customers with fast and convenient services. Tongfu Microelectronics has more than 18,000 employees all over the world.

FAQ

IC packaging refers to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and allow mounting of the electrical contacts connecting it to the printed circuit board (PCB). There are many different types of integrated circuits, and therefore there are different types of IC packaging systems designs to consider, as different types of circuit designs will have different needs when it comes to their outer shell.

  1. SINO IC Technology
  2. QIXIN MEMS
  3. NST
  4. Nantong Hualong Microelectronics
  5. Simat Microelectronics Technology
  6. Diantong Wintronic Microelectronics
  7. JCET Group
  8. China Wafer Level CSP
  9. HT-tech
  10. Tongfu Microelectronics

When you are looking for an IC packaging company, you should take the following factors into consideration so that you can find the best one.

  • Company’s reputation
  • Delivery time
  • Quality and price
  • Qualifications and certificates
  • After-sale services
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