In this ever-evolving technological landscape, flip-chip packaging has become one of the most popular choices for advanced electronic devices. Today, we’ll take you on a tour to discover the top 10 global flip chip package substrate manufacturers. Keep reading!
Taoyuan, Taiwan, China
Unimicron Technology Corporation is a printed circuit board (PCB) manufacturer headquartered in Taiwan. The company produces PCBs, high-density interconnection (HDI) boards, flexible PCBs, rigid-flex PCBs, integrated circuit (IC) carriers, and others. In addition, it provides testing and burn-in services of IC substrates and PCBs. Applications of its products and services include liquid crystal display (LCD) monitors, personal computers (PCs) and peripheral products, notebook computers, network cards, facsimile machines, scanners, mobile phones, personal digital assistants (PDAs), and others. Unimicron has manufacturing sites and/or service centers in Taiwan, China, Germany, and Japan.
Ogaki, Gifu, Japan
Ibiden Co., Ltd. is a Japanese electronics company headquartered in Ogaki, Gifu prefecture that manufactures electronics-related products, such as printed circuit boards and IC package. The company also makes ceramics products, including particulate filters for diesel engines, for which it has a 50% market share in Europe.
Today electronic components and ceramics are the company’s main products, with customers including Apple Inc., Intel and Groupe PSA (PSA Peugeot Citroën).
Nan Ya PCB
Nan Ya PCB Corporation used to be one of the business divisions of Nan Ya Plastics Corporation which is part of Formosa Plastics Group and turned into a subsidiary by 1997 as the manufacturer of Printed Circuit Boards (PCBs) and IC Substrates.
Shiko Electric Industries
Established in 1946, Shinko develops and produces various “Semiconductor Packages” adapted for the miniaturization, acceleration, and performance enhancement of semiconductors.
Shinko has subsidiaries in Japan and several other countries. Its products are sold to the whole world. Shinko aims to enrich and contribute to the lives of people all over the world by providing its cutting-edge packaging technologies, including for markets related to IoT and AI.
Leoben in Styria, Austria
AT&S also known as AT & S Austria Technologie & Systemtechnik Aktiengesellschaft designs and manufactures high-end printed circuit boards and substrates for semiconductors.
In Austria are two production sites in Leoben and Fehring, in India is one in Nanjangud and in China are two in Shanghai and Chongqing and in Korea is one in Ansan.
Kinsus Interconnect Technology
Taoyuan, Taiwan, China
Kinsus is an enterprise mainly engaged in the manufacture and sales of substrates. The headquarters is located in Xinwu Dist., Taoyuan City, with about 3,500 employees. Its main shareholder is ASUS Computer.
The company is mainly engaged in semiconductor materials, computers, electronics, communications, etc.
Kyocera Corporation is a Japanese multinational ceramics and electronics manufacturer headquartered in Kyoto, Japan. It manufactures industrial ceramics, solar power generating systems, telecommunications equipment, office document imaging equipment, electronic components, semiconductor packages, cutting tools, and components for medical and dental implant systems.
Zhen Ding Technology
Zhen Ding is a professional service provider that offers one-stop solutions for the design, development, manufacturing, and sales of all types of printed circuit boards, including flexible circuit boards (FPC), substrate-like PCBs (SLP), HDI PCB, rigid PCB, IC substrates, rigid-flex PCBs, chip-on-film (COF), and modules.
Gyeonggi-do, South Korea
Daeduck Electronics is a manufacturer of printed circuit boards (PCB) for semiconductor packaging. The company’s products include ultra thin CSP, fcCSP, fcBGA, and System in Package. Its products are used in smartphones, networking, and automotive industry.
Kaohsiung, Taiwan, China
ASE is the leading provider of semiconductor manufacturing services in assembly and testing.
ASE develops and offers complete turnkey solutions covering front-end engineering test, wafer probing, IC packaging and modules, materials, final test, system, and board level integration and, electronic design and manufacturing services(EMS).
Flip chip is not a specific package (like SOIC), or even a package type (like BGA). Flip chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then provides the connection from the die to the exterior of the package.
- Nan Ya PCB
- Shiko Electric Industries
- Kinsus Interconnect Technology
- Zhen Ding Technology
- Daeduck Electronics
When you are looking for a flip chip package substrate manufacturer, you should take the following factors into consideration so that you can find the best one.
- Company’s reputation
- Delivery time
- Quality and price
- Qualifications and certificates
- After-sale services