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TOP-10-global-BGA-packaging-substrate-suppliers-in-2023

BGA PCB assembly is the process of soldering a Ball Grid Array (BGA) package onto a Printed Circuit Board (PCB). A BGA package is an integrated circuit with several surface-mounted, small solder balls connecting its internal connections to the board. The BGA package is placed onto the board and then heated to melt the solder, creating electrical connections between the BGA and the PCB. In addition, BGAs are well-suited for use in environments with limited space, as they occupy a much smaller footprint than other packages.

In this article, we are going to introduce the top 10 global BGA packaging substrate suppliers in 2023.

Table of Contents

IBIDEN

Ibiden

Location

Gifu, Japan

Established time

1912-11-25

Company website

https://www.ibiden.com/

Company profile
IBIDEN Group started its business in 1912 as Ibigawa Electric Power Co., Ltd. with the mission of serving as the engine that would drive the local economy.

Main products and services
IBEIDEN provides services including: IC Package, Printed Wiring Board, SiC-DPF, Substrate Holding Mat, Graphite Specialty, High Temperature Insulation Wool

SHINKO

shinko

Location

Nagano, Japan

Established time

1946-09-12

Company website

https://www.shinko.co.jp/

Company profile
SHINKO ELECTRIC INDUSTRIES CO., LTD. has developed a global business that provides total solutions in semiconductor backend processing by applying and advancing a wide range of fundamental technologies for semiconductor packaging that it has cultivated since its founding, in order to contribute to the businesses of customers around the world.

Main products and services
Manufacturing and sales of plastic laminated packages (PLPs), leadframes, glass-to-metal seals, heat spreaders, ceramic electrostatic chucks, IC assembly and assembly of system modules.

SimmTech

SIMMTECH

Location

Chungcheongbuk-do, Korea

Established time

1987

Company website

http://eng.simmtech.com/

Company profile
SIMMTECH has been concentrating on developing and manufacturing High-layer PCBs for semiconductors since it was established in 1987. Through the accumulated world best manufacturing competitiveness, SIMMTECH is producing most advanced PCBs to semiconductor global leaders.

Main products and services
SIMMTECH’s major products are module PCBs for semiconductors’ memory expansion, and substrates for semiconductor chip assembly.

Korea Circuit

korea-circuit

LocationGyeonggi-do, Korea
Established time1972-05-11
Company websitehttps://www.kcg.co.kr/

Company profile
Korea Circuit is the pioneer of the Korean PCB industry. It has seen the development of Korea’s electronics industry as an expert in the production of PCB for the past 45 years.

Main products and services
Korea Circuit provides services like HDI PCB, package substrate, and rigid-flex PCB manufacturing.

Armed with state-of-the-art technology, it has developed world-class PCBs, and its applications range from home appliances including digital TVs and PCs to mobile devices like mobile phones and PDAs and memory, as the key to the IT industry.

SAMSUNG ELECTRO-MECHANICS

SAMSUNG-ELECTRONICS

LocationGyeonggi-do, Korea
Established time1973
Company websitehttps://www.samsungsem.com/

Company profile
Established in 1973, Samsung Electro-Mechanics has become a remarkable developer and manufacturer of key electronic components not only in Korea but also in other parts of the world.

Main product and services
Since the start of the 2000s, the company has been seeking to further develop strategic technologies and create business synergy based on core technologies of materials, multilayer thin-film molding, and high-frequency circuit design. With this at its core, it is focusing on fostering the business of chip parts, camera modules, communication modules and boards.

Key core technologies: bumping structure and μBall bump method
Substrate types include EPS(Embedded Passive Substrate) & EDS(Embedded Die Substrate) and ETS(Embedded Trace Substrate).

SEP Co ., Ltd

SEP

Location

Gyeonggi-Do, Korea

Established time

1993

Company website

http://www.sep.co.kr/

Company profile
SEP CO., LTD, founded in 1993, has developed into one of South Korea’s leading privately owned Printed Circuit Board & Contract Manufacturing companies. SEP offers a broad spectrum of high-reliability solutions to support the fabrication of complex and advanced technology printed circuit boards and sophisticated electronic assemblies.

Main products and services
SEP is manufacturing products covering most areas of the electronics industry including automotive, consumer, networking & communications, telecom, aerospace & military, medical, computing & storage, and cellular.

Nan Ya PCB Corporation

NYPCB

LocationTaiwan, China
Established time1997-10
Company websitehttps://www.nanyapcb.com.tw/

Company profile
Nan Ya PCB Corporation used to be one of the business divisions of Nan Ya Plastics Corporation which is part of Formosa Plastics Group and turned into a subsidiary by 1997 as the manufacturer of Printed Circuit Boards (PCBs) and IC Substrates.

Main products and services
Manufacturing and sales of conventional PCB, High density interconnection PCB(HDI PCB), rigid-flex PCB, ABF (Ajinomoto Build-up Film) substrate, and PP (Prepreg) substrate.

Kyocera

kyocera

Location

Kyoto, Japan

Established time

1959-04-01

Company website

https://global.kyocera.com/

Company profile
The Kyocera brand symbol is composed of a corporate mark and our corporate logotype. The mark represents the initial “K” (for Kyocera) encircling a “C” (for ceramics). It was introduced in October 1982 when the company name was changed from “Kyoto Ceramic” to “Kyocera.”

Main products and services
Kyocera provides electronic components, devices and materials like fine ceramic components, connectors, capacitors, power semiconductor devices, etc.

QP Technologies

QP-Technologies

Location

California, the USA

Established time

1987

Company website

https://www.qptechnologies.com/

Company profile
QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. It is leader in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Its 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered.

Main products and services
QP Technologies provides prototype and small-volume IC packaging and IC assembly services.

LG Innotek

LG-Innotek

Location

Seoul, Korea

Established time

1970

Company website

https://www.lginnotek.com/

Company profile
LG Innotek, Korea’s first electronic components company founded in 1970, has grown into a leading global materials and components company by intensively fostering world-class products through continuous technological development and process innovation.

Main products and services
LG Innotek supplies global customers with key electronic materials and components in the fields of mobile, display, semiconductor, automobile, and IoT that are developed and produced in its business sites at home and abroad.

Conclusion

Has more than 18 years on PCB and PCBA manufacturing, IBE enables to meet different types of customized PCB types and assemblies services. If you have any demands about our products, you can leave your comments below or contact our sales team,

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IBE Electronics is a leading EMS provider in China, with rich experience and expertise, providing customers with excellent service and creating superior products to improve people’s lives.

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