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PCB/PCBA knowledge
What Is PCB Copper Coating – A Complete Guide

What is PCB copper coating – a complete guide

PCB, which stands for Printed Circuit Board, plays a crucial role in the world of electronics. Copper coating, also known as copper plating, is an essential process in PCB manufacturing. It involves depositing a thin layer of copper onto the surface of the board to facilitate electrical conductivity and ensure reliable connections. This guide will take you on a journey to explore PCB copper coating. So, let’s dive in and unravel the wonders of PCB copper coating together!

PCB/PCBA knowledge
OSP Surface Treatment Process – A Complete Guide

OSP surface treatment process – a complete guide

The OSP surface treatment process refers to the formation of a protective layer to prevent oxidation on the PCB to improve the reliability and stability of the product. This article will give a detailed introduction to the OSP surface treatment process in the PCB process, including its process requirements and advantages.

News
12 cameras + 1 laser radar, What Apple’s First-generation Head

12 cameras + 1 laser radar, what Apple’s first-generation headset Vision Pro reveals?

“Today marks the beginning of a new era in computing!” Apple CEO Tim Cook declared. At the Apple Worldwide Developers Conference WWDC23 held in the early hours of June 6, Apple’s first head-mounted display device, Vision Pro, finally made its official debut. Apple says the Vision Pro, a headset that seamlessly blends digital content with the physical world, marks the beginning of “spatial computing.”

Electronic manufacturing industry
Advanced optical packaging – how much do you know

Advanced optical packaging – how much do you know ?

In recent years, the rapid development of application markets such as big data, cloud computing, 5G, IoT, and artificial intelligence has led to explosive growth in data traffic. Data centre interconnection has become a significant area of research in optical communications, with optical transceivers playing a vital role in optical communication systems. In this article, I will systematically introduce optical packaging, its importance, and its associated aspects.

Electronic manufacturing industry PCB/PCBA knowledge
Wafer Level Packaging (WLP) - A comprehensive guideline including FIWLP FOWLP

Wafer level packaging (WLP) – A comprehensive guideline including FIWLP, FOWLP

Wafer Level Packaging (WLP) is an advanced packaging technology. In recent years, with the development of more intelligent and sophisticated terminal applications such as mobile phones, computers, and AI, the demand for high computing power and highly integrated chips has increased. Therefore, advanced packaging technologies represented by Flip-Chip, 2.5D/3D IC package, wafer level packaging (WLP), and Sip are developing rapidly.

News
Strong demand for integrated circuits promote fierce competition of RF market in China

Strong demand for integrated circuits promote fierce competition of RF market in China

China is still a major importer of integrated circuits. In 2022, China’s integrated circuit products imported 415.579 billion USD and exported 153.918 billion USD. It shows that the demand for the Chinese integrated circuit industry is strong, and the willingness and demand for independent and controllable integrated circuit development are extremely urgent.

Electronic manufacture ranking
10 companies in the optical transceiver industry chain 2023

10 companies in the optical transceiver industry chain 2023

The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. To help you choose the best partner, this article will analyze and introduce 10 companies in the optical transceiver industry chain for you.

News
Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical modules, one of the hot spots of capital market hype this year, may be second only to AI in popularity. The concept of hype is “CPO”, that is, photoelectric co-packaging technology. This technology is expected to achieve low energy consumption and high energy efficiency in high computing power scenarios, and provide better computing power infrastructure for AIGC (AI generated content) applications such as ChatGPT.