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12 cameras + 1 laser radar, What Apple’s First-generation Head

12 cameras + 1 laser radar, what Apple’s first-generation headset Vision Pro reveals?

“Today marks the beginning of a new era in computing!” Apple CEO Tim Cook declared. At the Apple Worldwide Developers Conference WWDC23 held in the early hours of June 6, Apple’s first head-mounted display device, Vision Pro, finally made its official debut. Apple says the Vision Pro, a headset that seamlessly blends digital content with the physical world, marks the beginning of “spatial computing.”

Electronic manufacturing industry
Die bonder - what is die bonding technique and why die bonder important

Die bonder – what is die bonding technique and why die bonder important

With the continuous advancement of advanced packaging, the proportion of packaging and testing equipment in the semiconductor equipment industry has gradually increased. Die bonding is an important link in the post-process of semiconductor manufacturing. This article will introduce you in detail about die bonding techniques in semiconductor and die bonder machine.

Electronic manufacturing industry
Advanced optical packaging – how much do you know

Advanced optical packaging – how much do you know ?

In recent years, the rapid development of application markets such as big data, cloud computing, 5G, IoT, and artificial intelligence has led to explosive growth in data traffic. Data centre interconnection has become a significant area of research in optical communications, with optical transceivers playing a vital role in optical communication systems. In this article, I will systematically introduce optical packaging, its importance, and its associated aspects.

Electronic manufacturing industry PCB/PCBA knowledge
Wafer Level Packaging (WLP) - A comprehensive guideline including FIWLP FOWLP

Wafer level packaging (WLP) – A comprehensive guideline including FIWLP, FOWLP

Wafer Level Packaging (WLP) is an advanced packaging technology. In recent years, with the development of more intelligent and sophisticated terminal applications such as mobile phones, computers, and AI, the demand for high computing power and highly integrated chips has increased. Therefore, advanced packaging technologies represented by Flip-Chip, 2.5D/3D IC package, wafer level packaging (WLP), and Sip are developing rapidly.

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Strong demand for integrated circuits promote fierce competition of RF market in China

Strong demand for integrated circuits promote fierce competition of RF market in China

China is still a major importer of integrated circuits. In 2022, China’s integrated circuit products imported 415.579 billion USD and exported 153.918 billion USD. It shows that the demand for the Chinese integrated circuit industry is strong, and the willingness and demand for independent and controllable integrated circuit development are extremely urgent.

Electronic manufacture ranking
10 companies in the optical transceiver industry chain 2023

10 companies in the optical transceiver industry chain 2023

The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. To help you choose the best partner, this article will analyze and introduce 10 companies in the optical transceiver industry chain for you.

electronic components and devices Electronic manufacturing industry
A complete overview of chip lithography process

A complete overview of chip lithography process

In the modern society, the demand for chips is very large, and chip lithography is the most important, complex and expensive process in the chip manufacturing process. Its precision determines the manufacturing process of the chip and the performance of the device. So, a deep understanding of chip lithography process plays a vital role in chip manufacturing.

News
Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical modules, one of the hot spots of capital market hype this year, may be second only to AI in popularity. The concept of hype is “CPO”, that is, photoelectric co-packaging technology. This technology is expected to achieve low energy consumption and high energy efficiency in high computing power scenarios, and provide better computing power infrastructure for AIGC (AI generated content) applications such as ChatGPT.