Signal crosstalk means that the electromagnetic energy in one signal path is captured by another signal path, resulting in signal distortion and interference. Signal crosstalk is an important issue in chiplet packaging. Optimizing layout, using shielding technology, adopting differential signal transmission, optimizing impedance matching, etc., who can better reduce the mutual interference between electromagnetic fields and improve signal integrity and performance?
The feature of QFN without pins makes QFN can only be connected to the PCB pads through the device’s own grid. On the one hand, it cannot absorb the stress caused by thermal mismatch through the deformation of the pins. On the other hand, the grid is blocked by the device, which brings challenges to the detection and reliability of solder joints.