Welding stands as a foundational technique across industries, facilitating the joining of metals to create structures, machinery, and various products. Two primary methods dominate this field: manual welding, reliant on skilled human hands, and automated welding, employing sophisticated machinery for precision and efficiency.
This article introduces three SMT (Surface Mount Technology) welding processes, including reflow soldering, wave soldering, and through-hole reflow soldering. Keep reading!
PCBA processing and SMT processing are two different methods used in the production of electronic circuit boards. PCBA stands for Printed Circuit Board Assembly, while SMT refers to the specific technique used in the assembly process. Let’s have a detailed look at what is the difference between PCBA processing vs SMT processing.
This article mainly introduces the main methods of co-packaging technology for optical chips and electrical chips, and analyzes and compares their advantages and disadvantages.
As an important process in SMT assembly, precision dispensing is to pre-coat an adhesive on the PCB board where the patch needs to be mounted to fix the patch components.
Chip, or IC (Integrated Circuit), as a high-tech industry, is an industry that all countries in the world are vigorously developing and researching. The IC industry mainly includes three parts: IC design industry, IC manufacturing industry and IC packaging and testing industry. In this article, let’s take a deeper look at the chip packaging technology in IC packaging and testing.
PCB exposure equipment is a device that transfers pre-prepared circuit image information to copper substrates through photolithography technology. It is a comprehensive product integrating electrical automation, microelectronic control, mechanical design, optoelectronics, vacuum sealing, CCD alignment and other application technologies .
With the rapid development of science and technology, electronic products are entering our life at an alarming speed. In the field of electronic assembly, surface mount technology (SMT) and through hole technology (THT) are two main manufacturing methods. This article will introduce the differences between SMT vs THT in detail, including process principles, equipment requirements, assembly efficiency and quality.
With the rapid development of technology, the field of chip design and manufacturing is also constantly innovating. Chiplet technology, as an emerging solution, has attracted widespread attention. This article will discuss the advantages, disadvantages and future development trends of Chiplet technology.