In the realm of electronics, the packaging of components plays a crucial role in determining performance, size, and application possibilities. Two prevalent packaging methods, Chip on Board (COB) and Surface Mount Device (SMD), stand out for their distinct characteristics and applications. Understanding the differences between COB packaging vs SMD packaging is essential for engineers, hobbyists, and enthusiasts alike. Keep reading.
This method of packaging, compact and economizing on space, is the preferred choice for various applications where space, mass, and functionality play crucial roles. In this investigation, we explore WLCSP’s intricacies, from its components to its proportions, unveiling the technology underpinning many of our daily compact electronic tools.