When the electronic products turn their direction to become more thin, small and light, they also ask for the requirement of high density for PCB. HDI (High density interconnect) achieves smaller apertures, thinner line widths, fewer through-hole vias, which enable to save PCB wiring area, greatly increase component density, and improve radio frequency interference, electromagnetic interference and electrostatic discharge, etc.
With the popularity of various wearable devices and vehicle-mounted HDI PCB products, the market for HDI PCB tends to have great growth in the future. It’s reported that the global HDI output value achieves US$11.8 billion in 2021, and the CAGR of HDI output value is expected to be 4.9% from 2021 to 2026. By 2026, the global HDI output value will increase to US$15 billion.