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Electronic manufacturing industry
PCB Terminology

The world of electronics is a realm where innovation and precision intersect. Printed Circuit Boards (PCBs) lie at the heart of this technological landscape, serving as the foundational framework upon which electronic components are interconnected to create functional devices. Understanding PCB Terminology is akin to unlocking the language of this intricate ecosystem. From novices to seasoned professionals, a comprehensive grasp of PCB Terminology is indispensable for effective communication, troubleshooting, and design optimization.

This preface sets the stage for a journey into the lexicon of PCBs, where terms like “Lay Up,” “Inner Etching,” and “AOI” take on profound significance. Through this exploration, readers will not only gain insights into the technical nuances of PCB design and manufacturing but also cultivate a deeper appreciation for the ingenuity that underpins modern electronics.

Table of Contents

PCB manufacturing process

PCB Terminology

CUT:
MCU -Material Cutting
ILB – Inner Laser Barcode

IDF:

ILP – Inner Layer Pre-Treatment
IDL – Inner D/F Lamination
ILC – Inner Liquid Coating
IEX – Inner Exposuring
IDI – Inner Laser Direct Image
ILD – Inner Layer Development
IET – Inner Etching
IDS – Inner D/F Stripping
IDES – Inner Developing, Etching, Stripping
QIDF – IPQC for Inner D/F

AOI:

IOA – Inner Offline AOI
IAO – Inner AOI
IVR – Inner VRS
WFI – Warehouse for Inner Layers

BOR:

OPE – OPE Punching
BOR – Brown Oxide Replacement
BAB – Baking after Brown Oxide Replacement

LAM:

PBO – PIN Bonding
CBO – CCD Bonding
RBO – Riveting & Bonding
CCI – Copper Coin Inserting
PLU – Pre Lay Up
LUP – Lay Up
PRE – Pressing
UBO – Unpacking Board
DEP – Depanelization
PER – Panel Edge Routing
MBD – Mechanical Barcode Drilling
PPC – PP Cutting
PPD – PP Drilling

LAS:

XFH – X-RAY Four Holes
LOR – Laser Oxide Replacement
LDD – Laser Direct Drilling
LKN – Laser Cutting
QLAS – IPQC for Laser

DRL:

THD – Target Holes Drilling
XTH – X-RAY Three Holes
APF – Auto PIN Fixing
DRL – Mechanical Drilling
MDH – Mechanical Drilling POFV Hole
1RAD – 1st Routing after Drilling
CHC – Coin Hole Checking
PINR – PIN Removing

DEB:

DEB – Deburring
HPR – High Pressure Rinsing
HCA – Hole Checking after Deburring

DCD:

DDT – DCD from Top Side
DDS – DCD from Bot Side
BDT – Back Drilling from Top side
BDB – Back Drilling from Bot side
1RAP – 1st Routing after Pattern Plating
2RAP – 2nd Routing after Pattern Plating

2DCD:

2BDT- 2nd Back Drilling from Top side
2BDB – 2nd Back Drilling from Bot side

2DRL:

2DR – 2nd Drilling
3DR – 3rd Drilling
4DR – 4th Drilling

PLA:

Plasma – PDE Plasma Desmear
BAM – Baking after Mechanical Drilling
PTH – Horizontal PTH
PPP – Pulse Panel Plating
PBP – PTH before POFV
POFV – Plate over Filling Via
CPP – Copper Panel Plating
SVP – Solid Via Plating
PAS – Plating after Solid Via Plating
BPL – Button Plating
FPP – Flash Panel Plating
QPLA – IPQC for Panel Plating

APR:

BAP – Baking before Plugging
APA – Auto Plugging and Curing
VPL – Vacuum Plugging
VPL2 – Vacuum Plugging2
GAP – Grinding and Polishing
RSC – Resin Scrubbing
CAV – Curing after Vacuum Plugging

AOI:

AAS- AOI after Scrubbing

CRT:

CRE – Copper Reduction

ODF:

OLP – Outer Layer Pre-treatment
ODL – Outer D/F Lamination
OEX – Outer D/F Exposuring
ODI – Outer Laser Direct Image
ODE – Outer Development
OET – Outer Etching
QODF – IPQC for Outer D/F
ODS – Outer D/F Stripping
ODES – Outer D/F Development, Etching, Stripping
RFL1 – Radio Freqency Line Width Measurement 1
EDM – Etching Depth Measuring
DBC – D/FPre-treatment before Copper Reduction
DBR – D/F Lamination before Copper Reduction
DER – D/F Exposuring before Copper Reduction
DDR – D/F Development before Copper Reduction
DDC – D/F Laser Direct Image before Copper Reduction
DSR – D/F Stripping after Copper Reduction
DPB – D/F Pre-treatment before Hole Plating
DLB – D/F Lamination before Hole Plating
DEH – D/F Exposuring before Hole Plating
DDB – D/F Development before Hole Plating
DLH – D/F Laser Direct Image before Hole Plating
DSA – D/F Stripping after Hole Plating

MASK:

MPR – Mask Pre-treatment
MDL – Mask D/F Laminator
MLI – Mask Laser Image
MDE – Mask D/F Exposure
MDES – Mask Development ,Etching, Stripping

AOI:

OOA – Outer Offline AOI
OAO – Outer AOI
QRE1 – IPQC for Registration 1
OVR – Outer VRS
MAO – Mask AOI
SAO – Solid Via Filling Plating AOI

IMP:

QIM1 – IPQC for Impedance Test 1

PAT:

PAT – Pattern Plating
PPA – Pulse Pattern Plating
QPAT – IPQC for Pattern Plating

SES:

SAP – Stripping after Pattern Plating
TSR – Tin Stripping
ETS – Etching, Tin Stripping
SES – DF Stripping, Etching, Tin Stripping
QSES – IPQC for Alkaline Etching

SM:

SPS – S/M Pumice Scrubbing
SCP – S/M Chemical Pre-treatment
SMP – Solder Mask Plugging
2SMP – 2nd Solder Mask Plugging
SPR – Silkscreen Printing
ESC – Electrostatic Spray Coating
LPS – Low Pressure Spray Coating
SPC – S/M Pre-cure
SDE – S/M DI Exposuring
ASE – Auto S/M Exposuring
SMD – S/M Developing
QSM – IPQC for S/M
SAV – S/M AVI
SMC – S/M Post-cure
SMS – S/M Stripping
BBS – Baking before S/M Pre-treatment
SMC1 – S/M Post-cure 1
SPS2 – S/M Pumice Scrubbing 2
SPR2 – Silkscreen Printing 2
SPC2 – S/M Pre-cure 2
ASE2 – Auto S/M Exposuring 2
SDE2 – S/M DI Exposuring 2
SMD2 – S/M Developing 2
SMC2 – S/M Post-cure 2

CMP:

CMP – Component Mark Printing
CSC – C/M Spray Coating
CPC – C/M Post-cure
PCP – Printed C/M Post-cure
QCMP – IPQC for Component Marking
LBP – Laser Barcode Printing

SSM:

SSP – Selective S/M Pre-treatment
SSM – Selective S/M Printing
SST – Selective S/M Post-cure

IMP:

QIM2 – IPQC for Impedance Test 2

DF2:

PTB – Pre-treatment before Gold Plating
LBG – Lamination before Gold Plating
EBG – Exposuring before Gold Plating
DBG – Developing before Gold Plating
2OLP – 2nd Outer Layer Pre-treatment
2ODL – 2nd Outer D/F Lamination
2OEX – 2nd Outer D/F Exposuring
2ODE – 2nd Outer Development

DF3:

3OLP – 3rd Outer Layer Pre-treatment
3ODL – 3rd Outer D/F Lamination
3OEX – 3rd Outer D/F Exposuring
3ODE – 3rd Outer Development

DF4:

4OLP – 4th Outer Layer Pre-treatment
4ODL – 4th Outer D/F Lamination
4OEX – 4th Outer D/F Exposuring
4ODE – 4th Outer Development

PSM:

PSM – Peelable S/M Printing
PSP – Peelable S/M Post-cure

RIP:

PBR – Pre-treatment before Resist Ink Printing
RIP – Resist Ink Printing
PCR – Pre-cure in Resist Ink Printing
ERP – Exposuring in Resist Ink Printing
DRI – Development in Resist Ink Printing

PAH:

SPH – S/M Plugging after HASL
PSH – Pre-cure after S/M Plugging in HASL Process
ESP – Exposuring after S/M Plugging in HASL Process
DSP – Development after S/M Plugging in HASL Process
PCH – Post-cure after S/M Plugging in HASL Process

GFP:

TPG – Tape Paste before GFP
LCT – Laser Cutting on Tape
PBG – Pre-treatment before GFP
GFP – Gold Finger Plating
WCG – Water Cleaning after GFP
DSG – DF Stripping after GFP
TSG – Tape Stripping after GFP
QSF1 – IPQC for Surface Finish Coating 1

ENIG;

JSB – Jet Scrubbing before ENIG
ETA – Edge Taping
RTP – Red Tape Pasting
EDS – ENIG D/F Stripping
TRE – Tape Removing after ENIG
WRA – Water Rinsing after ENIG
ENEP – ENEPIG
QSF2 – IPQC for Surface Finish Coating 2

GLP:

ETG – Edge Taping for GLP
NAP – Ni/Au Plating
TGP – Thick Gold Plating
HGP – Hard Gold Plating
TRG – Tape Removing after GLP
CNA – Cu/Ni/Au Plating
WRN – Water Rinsing after Ni/Au Plating
QSF3 – IPQC for Surface Finish Coating 3

DIS:

DIS – D/F or Ink Stripping
WRD – Water Rinsing after DIS
AEB – Alkaline Etching Bussing Line

OSP:

TPO – Tape Paste for OSP
OSP – OSP OSP
TRO – Tape Removing for OSP
QSF4 – IPQC for Surface Finish Coating 4

JSC:

JSC – Jet Scrubbing

IAG:

TPA – Tape Paste for IAG
IAG – Immersion Silver
TRA – Tape Removing after IAG
QSF5 – IPQC for Surface Finish Coating 5

ITN:

TPI – Tape Paste for ITN
ITN – Immersion Tin
TRI – Tape Removing after ITN
QSF6 – IPQC for Surface Finish Coating 6

ROU:

QRE2 – IPQC for Registration 2
VCT – V-CUT
BEV – Beveling
ROU – Routing
1ROU – 1st Routing
DFD – DCR from Top Side after Drilling
DFS DCR from Bot Side after Drilling
DCT – DCR from Top side after Pattern Plating
DCB – DCR from Bot side after Pattern Plating
DFT – DCR from Top side before Routing
DFB – DCR from Bot side before Routing
2ROU – 2nd Routing
CCDR – CCD Routing
RTE – Reflow Testing
QROU – IPQC for Routing

IMP:

QIM3 – IPQC for Impedance Test 3

ET:

WRR – Water Rinsing after Routing
ET – Electrical Testing
FPT – Fly Probe Testing
HPT – HI-POT Testing
ITE – Inductance Testing
PET – Panel Electrical Testing
BTC – Bow and Twist Checking
HCK – Hole Checking
ILT – Insert Loss Testing
2ET – 2nd Electrical Testing
RFL2 – Radio Frequency Line Width Measurement 2
4WT – 4 Wire Testing

FQC:

AVI
HAVI – High Accuracy AVI
VIS – Visual Inspection
BBP – Baking before Packing
MDP – Manual Depanelization
WRC – Water Rinsing after Checking
2FQC – 2nd FQC

OQC:

OQC – Outgoing Quality Control

PKG:

BLC – Barcode Label Scanning
PKG – Packing

FIN:

WFG – Warehouse for Finished Good

CIP:

CIP – Carbon Ink Printing
CRM – Carbon Resistance Measuring
CIC – Carbon Ink Post-cure

HASL:

PBH – Pre-treatment before HASL
TPH – Tape Paste for HASL
BBH – Baking before HASL

PAH – Post-treatment after HASL
QSF7 – IPQC for Surface Finish Coating 7

LHAL:

LPBH – Pre-treatment before LF HASL
LTPH – Tape Paste for LF HASL
LBBH – Baking before LF HASL
LHAL – LF HASL
LPAH – Post-treatment after LHAL
QSF8 – IPQC for Surface Finish Coating 8

PCB Process-related terminology

PCB Terminology

Mechanical Process:

Chamfer
Drill Bit Size
Hook
Drill Bit Length
Overlap (Drill)
Shank
Shank Diameter
Hole Edge Roughness
Hole Roughness
Entry/Backup Material
Hole Base Positioning
Punching

Imaging and Application of Resists and Inks:

Bleeding
Permanent Resist
Photographic Layer
Photoprint
Photoresist Image
Silk Screen
Silk Screening
Tending
Usable Resolution
Screen Printing
Resist (Mask)
Printing
Development (Resist)
Exposure
Lamination (Dry Film)
Laser Direct Imaging (LDI)
Hole Filling Process
Hole Plugging Process
Strip (Resist Stripping)

Material Deposition Process, including Plating:

Accelerator
Activating
Activating Layer
Adhesion Promotion
Aspect Ratio (Hole)
Blow Hole
Catalyzing
Critical Current Density
Electrodeposition
Electroless Deposition
Electrolytic Deposition
Electroplating
Galvanic Deposition
Galvanic Displacement
Immersion Plating
Initiating
Panel Plating
Pattern Plating
Plating
Plating Bar
Solder Coat
Semi-Additive Process
Swell-and-Etch Process
Dendrite Crystal
Contact Plating
Overplate
Solder Levelling
Plating, Palladium
Plating, Tin
Step Plating

Material Removal Process, including Etching:

Conducting Salt
Etchant
Etch Factor
Etching
Negative Etchback
Smear Removal
Acid Value
Shadowing, Etchback
Etchback
Etching Indicator
Differential Etching
Etch Resist
Abrasion Resistance
Stamp Hole
V-Groove/V-Cut
Reverse Etchback
Routing
Router bit
Under cut

Lamination:

Bonding Layer
Gel Time
Lamination
Laminate
Preflow
Weave
Mass Lamination
Layer-to-Layer Registration
Lay-up
Pin Lamination
Time to Decomposition (Td)

Thermal Cure/Firing Process:

Cure
Curing Agent
Fusing Fluid
Hardness
Heat of Fusion
Intumescence
Leveling
Leveling Flux
Leveling Oil
Post Curing
Preheat
Fusing Flux
Fusing Oil
Preheating
Fusing

Cleaning and Chemical Treatment Process:

Anodic Cleaning
Cathodic Cleaning
Desmear

General:

Annular Ring
Annular Width
Bare Board
Board
Bond Strength
Card
Conductor Based Spacing
Conductor Based Width
Double-Sided Printed Board
Etched Printed Boards
Multilayer Printed Circuit Board
Overhang
Warp
Bow
Twist
Conductor Spacing
Conductor Width
Wrap Plating
Finished Board
Rigid Printed Board
Metal Core Printed Board
Bar Code
Bar Code Printer
Bar Code Scanner/Reader
Two-Dimensional Code (2D Code)
Elongation
Contact Resistance
Step Scale
Step Wedge
Storage Life
Production Panel
Delivered Panel/Set
Registration
Thermal Zone
Base Material
Copper-clad Laminate
Via
Blind Via
Buried Via
Conductor Spacing
Hole In Pad
Throwing Power
Copper Foil Thickness
Outline Dimensions
Thickness
Dielectric
Buried Copper/Coin PCB
Embedded Copper/Coin PCB
Sampling
Ground Side
Leadless Chip Carriers (LCC)
Land Grid Array (LGA)
Pitch to pitch

Reliability testing

Microsectioning
Glass Transition Temperature(Tg)Test
Backlighting Test
Conductive Anodic Filament(CAF)Test
Surface Insulation Resistance (SIR)Test
P content/Ni corrosion Test
Thermal Shock Test
Ionic Contamination Test
Coefficient of Thermal Expansion(CTE)Test
Time to Delamination Test
Wetting Balance Test
Etch Factor Test
Throwing Power Test
Tensile Strength and Elongation Test
PTH Bond Strength Test
Peel Strength Test
ROHS Test
Thermal Stress Test
Solderability Test
Reflow Test
Dielectric Withstanding Voltage Test
Chemical Resistance Test
Rework Simulation Test
Multifunction Bond Test
Solder Resistance Test
Solder Paste Printing Test
Porosity Test
Salt Spray Test
Interconnect Stress Test
Solder Mask Abrasion Test (Pencil Method)
Solder Mask Abrasion Test (Cross-Cut Tester)
Tin Whisker Test
Low Resistance Test
Insertion Loss Test
Impedance test

PCB Terminology

Common PCB defect

De-Lamination
Warpage
Burnt Board
Hi-pot Test Fail
Bubble
Drilling Damaged
Block Hole
Extra Copper around the Holes
Hole Oversize
Hole Undersize
Incomplete Drilling
Missing Hole
Extra Hole
Blind Via Shift
Broken Hole
Breakout
Solder in NPTH Hole
Hole Shift
Drill Bit Broken
Rough Hole
Slot Hole Abnormity
Copper in NPTH Hole(Hole)
Haloing
Incomplete Slot Drilling Slot
Stamp Holes Missing
No Copper in hole
Thin Copper Plating
Open
Laser Via Shift
Block Hole
Separation in Laser Via
Crack in Laser Via
PTH Void
Plating Void
PTH Open
Rough Plating
Poor Plug Hole
Copper Residue
Foreign Metal
Nodule, Contamination
Gold Protrusion
Cu/Gold Particle
Copper Residue Between G/F
Residue in Hole
Void in PTH Hole
Burnt board
Plating Void
Good Board
Short Circuitry
Trace Void
Open
Broken Holes
Nick Trace
Void in Line/Nick
Poor Exposed
Dry Film Residue
D/F Poor Registration
Dry Film Residue
D/F Peel Off and Hole Shift
D/F Scratch
Discoloration Under S/M
Tending Hole Void
Pad Peel Off
Missing Mark Point
Exposed Laminate
Plated Metal in Non-PTH Hole
Pad Immersion Gold on Pad
Au in NPTH Hole
Pin Hole
Under Developing
Under-Etching
Over-Etching
Over-Etching on Ground Area
Pad Peel Off
Partially Pad Peel Off
BGA Pad Peel Off
Laminate Exposed
Exposed Laminate on Pad
Abnormal Fiducial Mark
Fiducial Mark Peel Off
Good PCB
Line Width Lower than Spec.
Excessive Undercut
Bonding Pad over Etching
Plating Color Change
Expose Copper on Pad BGA
Expose Copper
Skip Plating on Pad
Skip Plating
Missing Gold on Fiducial Mark
Rough Plating
Poor Component Mark Printing
Component Mark on Pad
Poor Rework on Component Mark Printing
Component Mark Printing is Higher than Pad
Wrong Component Mark Printing
Double Image of Component Mark Printing
Component Mark Printing on BGA Location
Component Mark Peel Off
IC Barrier Broken
Component Mark Printing Shift
Component Mark Printing Step on Pad
Uneven S/M Printing
Oxide Under S/M
Solvent Test Fail
Tape Test Fail–Cu Exposed
S/M Blister
S/M Oxidation
Exposed Copper on Gold Finger
Cu Exposed
Pad S/M on Pad
Pad S/M Shift to Pad
Poor S/M
Foreign Material
Conductor Exposed
Cosmetic Issue
S/M Peel Off
Broken S/M Bridge
Solder Mask Dam Damaged
Exposed Laminate
S/M Void
Poor S/M Plug Hole
Gold Ring
Solder Mask Shift
S/M on Fiducial Mark
S/M in Hole
S/M over Thickness
Non-Wetting
Solder Mask Bleeding
Solder Mask on Gold Surface
Extra Solder Mask
Fudicial Mark Au Smear
Oxidization on Gold
Gold on Pad
Gold Peel Off
Gold on Copper Surface
Rough Plating
Dull Color
Hole Damage
Rough Surface
Tin Ball
Tin Residue
Tin Residue in Hole
Tin Residue on Soldering surface
Tin Residue on Board Surface
Tin Residue
Remained Gold Finger Plating Bar
Gold Finger Skip Plating
Dent on Gold Finger
Gold Bump on G/F
Extra Metal
Dent on Gold Finger
G/F Damaged
Dimension out of Spec.
Poor Routing
Routing Shift
Routing Particles
Rough Routing
Routing Outline Damaged
Missing Routing
Burr on the Edge
V-CUT Damaged
V-CUT Wrong Size
V-CUT Shift
Double V-CUT
V-cut Remained Thickness over Size
Missing V-CUT
Test Pin Mark on G/F
E-Test Pin Dent
Peeling Off Copper
T-Marking Stained on G/F
E/T Mark on Board
Outer Nick Trace
Excessive Touch Up
Poor BGA/Dent
Bad Rework on BGA Pad
Scratch Cause by Poor Rework
Poor S/M Touch Up
Poor Solder Mask Touch Up
Contamination
Marking Ink Stain on G/F
Marking Ink Stain on Board
Dirty on the Gold Pad
Scratch
Board Corner Damaged
Pad Damaged
Fiducial Mark Peel Off
Poor OSP
Discoloration on Silver Surface
Oxidization
Metallic Residue
Metal Residue
Discoloration on Silver Surface
Pen Mark
Discoloration
Poor S/M Rework
Immersion Silver on G/F
Immersion Silver
Package Damaged
Label Wrinkle and Poor Printing
Color Changed on HIC Card
Mixed Boards in Packing

Conclusion

In conclusion, delving into the realm of PCB Terminology unveils the intricate tapestry that forms the backbone of modern electronics. From the humble beginnings of understanding basic concepts like “circuit” and “conductor” to grappling with advanced terms such as “impedance matching” and “blind vias,” this journey epitomizes the evolution of knowledge and expertise.

Armed with a nuanced understanding of PCB Terminology, engineers and enthusiasts alike are empowered to navigate the complexities of electronic design with confidence and precision. Moreover, as technology continues to advance at an exponential pace, the significance of staying abreast of emerging PCB Terminology cannot be overstated.

As we bid farewell to this exploration, let us carry forward the insights gained, recognizing that PCB Terminology is not merely a collection of words and phrases but a gateway to innovation, collaboration, and the relentless pursuit of progress in the realm of electronics.

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