IBE enables the world’s best brands. Through our unrivalled customer-centric approach, we partner with leading companies in numerous markets to deliver solutions for their most complex challenges.
IBe Industry Building, ShenZhen, China
ibe@ibepcbaaa.com
+86-75581785031
As an experienced PCB fabrication services provider since 2005, IBE has its own professional teams to provide satisfactory manufacturing services for customers’ customized demands. We provide one-stop PCB fabrication services from PCB layout design, and PCB manufacturing to shipping.
Different from PCB assembly, PCB fabrication is to transform a circuit board design into the physical structure of the board. For example, at the fabrication stage, the PCB consists of a flat sheet of insulating material and a layer of copper foil laminated to the substrate that supports electric components that are connected to it later.
18 years of experience working with a wide range of vendors has uniquely positioned IBE to help work through any concerns that you may have about PCB fabrication and PCB manufacturing, and answer all of your questions.
Possessed advanced technology and machines of PCB fabrication, IBE enables to meet your customized demands and ensure high-quality and favorable prices. Our experts are well-prepared and capable of managing PCB design and PCB fabrication based on customers’ needs. We provide PCB fabrication services including multilayer PCBs, quick turn PCB fab, rigid-flex PCBs, Rigid-Flex PCBs, ATE printed circuit boards, metal core PCB fabrication, standard PCB fabrication, custom PCB fabrication, hybrid PCB fab, PCB testing, and more. Our PCB fabrication services are available in no matter high volume or low volume printed circuit board demands.
| Item # | Item Name | PCB Capability |
|---|---|---|
| 1 | Base material | Normal-Tg FR4,mid-Tg FR4 , High-Tg FR4, PTFE, Rogers, Low Dk/Df etc. |
| 2 | Solder mask color | Green, red, blue, white, yellow,purple, black, gray, orange , matt green, matt blue, matt red, matt black |
| 3 | Legend color | White, yellow, black, red |
| 4 | Surface treatment type | ENIG, Immersion tin, HASL, HASL LF, OSP, Plating Ni/Au, Gold finger,Immersion silver, Plating soft Au,Selective plating gold. |
| 5 | Max. layer-up(L) | 64 |
| 6 | Max. delivered size (set/panel) (mm) | 880*620 |
| 7 | Max. working panel size (mm) | 650*1100 |
| 8 | Registration accuracy between the layers | ±0.10 |
| 9 | Max. board thickness (mm) | 12 |
| 10 | Min. board thickness(mm) | 0.3 |
| 11 | Finished hole tolerance(PTH) | ±0.05mm |
| 12 | Finished hole tolerance(NPTH) | ±0.03mm |
| 13 | Board thickness tolerance (mm) | T<1.0 mm: +/-0.10mm; T≥1.00mm: +/-10% |
| 14 | Line width/space (mm) | 0.075/ 0.075 for 1/2OZ base copper |
| 15 | Back drill capability | Yes |
| 16 | Tolerance of back drill (mm) | depth tolerance is ±0.05 |
| 17 | Tolerance of press fit holes (mm) | ±0.05 |
| 18 | Registration tolerance (mm) | ±0.10 |
| 19 | Min. core thickness excluding copper(mm) | 0.05 |
| 20 | Warpage tolerance (%) | 0.75% |
| 21 | Profile size tolerance (mm) | ±0.1(±0.05) |
| 22 | Min. hole wall to copper space(mm) | "L≤10, 0.15； L=12-22,0.175； L=24-34, 0.2； L=36-44, 0.25； L>44, 0.3" |
| 23 | Min. innerlayer clearance(mm) | 0.1 |
| 24 | Min. hole edge to hole edge space(mm) | 0.35 |
| 25 | Min. hole edge to profile line space(mm) | 0.2 |
| 26 | Min. innerlayer copper to profile line sapce (mm) | 0.2 |
| 27 | Registration tolerace between holes (mm) | ±0.05mm |
| 28 | Max. finished copper thickness(um) | "Outer Layer: 420 (12oz) Inner Layer: 210 (6oz)" |
| 29 | Solder mask thickness (um) | "line corner : >5㎛ (0.3mil) upon copper: >10㎛ (0.4mil)" |
| 30 | ENIG Au thickness (um) | 0.025-0.125 |
| 31 | ENIG Ni thickness (um) | 3-5 |
| 32 | Immersion silver thickness (um) | 0.15-0.75 |
| 33 | Min. HAL tin thickness (um) | 0.75 for surface , 0.5 in holes |
| 34 | Immersion tin thickness (um) | 0.8-1.2 |
| 35 | Hard-thick gold plating Au thickness (um) | 1.27-2.0 |
| 36 | Gold finger plating gold thickness (um) | 0.025-1.51 |
| 37 | Gold finger plating nickle thickness(um) | 3-15 |
| 38 | Flash gold plating gold thickness (um) | 0.025-0.05 |
| 39 | Flash gold plating nickle thickness (um) | 3-8 |
| 40 | Min. legend width(mm) | 0.1 |
| 41 | Min. legend height (mm) | 0.76 |
| 42 | Max. solder mask plugging hole size (mm) | 0.6 |
| 43 | BGA pad (mm) | ≥0.25 (HAL or HAL Free：0.35) |
| 44 | V-CUT angle (º) | 20º, 30º, 45º,60º,90º |
| 45 | V-CUT blade position tolerance (mm) | ±0.01 |
| 46 | V-CUT position tolerance (mm) | ±0.01 |
| 47 | Gold finger bevel angle (o) | 15º-60º |
| 48 | Gold finger bevel angle tolerance (o) | ±5 |
| 49 | Impedence tolerance (%) | ±5% for sample |
| 50 | Impedance tolerance (%) for MP | ±10% |
| 51 | Min. pattern to edge for v-cut (mm) | (Depends on V-cut angle and depth) |
| 52 | Flame retardance class | 94V-0 |
| Item # | Item Name | PCB Capability |
|---|---|---|
| Special for Via in pad produc ts | Resin plugged hole size (min.) (mm) | 0.3 |
| Resin plugged hole size (max.) (mm) | 0.75 | |
| Resin plugged board thickness (min.) (mm) | 0.3 | |
| Resin plugged board thickness(max.)(mm) | 8 | |
| Resin plugged maximum aspect ratio | 20:01 | |
| Resin plugged minimum hole to hole space (mm) | 0.65 | |
| Can different hole size in one board? | yes | |
| Special for HDI | Min. mechanical drilling hole diameter (mm) | 0.15 |
| Min. laser drilling hole diameter(mm) | 0.075 | |
| Max. aspect ratio(micro-via) | 1:01 | |
| Max. dielectric thickness for laser drill(mm) | 0.15 | |
| Min. dielectric thickness for laser drill | 0.05 | |
| Bottom Pad size (under micro-via) (mm) | Hole size+0.17 | |
| Top side Pad size ( on micro-via) (mm) | Hole size+0.15 | |
| Copper filling or not (yes or no) | yes | |
| Via in Pad design or not ( yes or no) | yes | |
| Buried hole resin plugged (yes or no) | yes | |
| Min. via size can be copper filled (mm) | 0.075 | |
| Max. stack times | 4 | |
| Rigid-flex board | Max. delivered size (set/panel) (mm) | 50*50 |
| Max. working panel size (mm) | 500*600 | |
| Max. board thickness (mm) | 3 | |
| Max. layer-up(L) | 20 | |
| Aspect ratio | 12:1 (Min. hole: 0.4 mm) | |
| Line width/space (mm) | 0.075/ 0.075 | |
| Back drill capability | Yes | |
| Tolerance of back drill (mm) | ±0.075 | |
| Tolerance of press fit holes (mm) | ±0.075 | |
| Hole size (mm) | 0.2 | |
| Dielectrical thickness (mm) | 0.025 | |
| Stiffener | Yes | |
| Flex board layers (L) | 8 (4plys of flex board) | |
| Rigid board layers (L) | ≥14 | |
| Surface treatment | All | |
| Flex board in mid or outer layer | Both |
Nanotechnology immersion along the information highway will close the loop on focusing solely
Nanotechnology immersion along the information highway will close the loop on focusing solely
Dynamically innovate resource-leveling customer service for state of the art customer service.
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Nanotechnology immersion along the information highway will close the loop on focusing solelyframeworkframeworkframeworkframework
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Dynamically innovate resource-leveling customer service for state of the art customer service.
Nanotechnology immersion along the information highway will close the loop on focusing solely
Nanotechnology immersion along the information highway will close the loop on focusing solely
Podcasting operational change management inside of workflows to establish a framework.
Dynamically innovate resource-leveling customer service for state of the art customer service.
Nanotechnology immersion along the information highway will close the loop on focusing solely
Nanotechnology immersion along the information highway will close the loop on focusing solely
Podcasting operational change management inside of workflows to establish a framework.
Dynamically innovate resource-leveling customer service for state of the art customer service.
Nanotechnology immersion along the information highway will close the loop on focusing solely
Nanotechnology immersion along the information highway will close the loop on focusing solely
Podcasting operational change management inside of workflows to establish a framework.
Dynamically innovate resource-leveling customer service for state of the art customer service.
Nanotechnology immersion along the information highway will close the loop on focusing solely
Dynamically innovate resource-leveling customer service for state of the art customer service.
Founder at IBE
IBE Electronics is evolving the way leading companies in industrial tech, medical tech, and other industries innovate and bring new products to market.
Quality control
IBE has successively obtained ISO9001, ISO14001, ISO45001, UL certification, Disney FAMA authorization and other certifications.
We strictly abide by IATF16949 and ISO13485 manufacturing standards for automotive and medical industry, adhere to strict quality control processes. Meanwhile, we also can provide 3C, CE, FDA, UL certification on behalf of customers.
Quick Turnaround Time
The whole PCB fabrication procedure, IBE uses advanced technology and machines to improve the quick turnaround time for customers to arrange the fastest shipment.
Besides, we have a professional team to respond your quick quotes and provide support on products’ designs and delivery time. Our quick turnaround time strength ensures that our customers better expand their markets.
Security and Safety
IBE strictly monitors the whole PCB fabrication process according to industry standards and requirements for security.
Reliable sales services
Our IBE team provides 7/24 live sales and engineering support to solve your confusion related to PCB fabrication. We offer 24-hour turnaround on prototypes, backed by 100% on-time guaranteed delivery.
Fabrication of printed circuit boards (Fabrication of PCB) is done in several ways. These are classified as:
The complete PCB fabrication process is based on the design package that makes the circuit board in physical form. Following is the process of fabrication of PCB which starts with design and ends with testing:
Make the Design of the board for the further process. Used it as a blueprint of your PCB. Various software is available for this; when the Design is ready, print it using a plotted printer.
Create the substrate and make sure its material is insulated. Copper covers both sides of the layer.
Make sure the blueprint and real print are aligned. Hole the circuit board so that the whole Design is printed serially using photo-reactive chemicals
It shows all the paths of copper. It hardens the photoresist. To remove additional photoresist, dip the circuit board in the chemical solution of alkaline.
Dip the board in another solution, same as alkaline, to remove the extra copper. The photoresist stays. There is no side effect on the photoresist by using the chemicals.
Now check that the layers are aligned or not by seeing the holes of the layers. After this step, you cannot rectify the mistakes of the previous steps. So do it carefully.
In this process, metals hold the layers because there is a fusion between the layers. Now, there is no requirement for a copper layer. Then press all the layers by using a mechanical press. Pin the layers so that they are aligned together.
If any copper remains on the layers' inner surface, it is removed by drilling guided by the computer. A chemical solution fuses all the layers. Now you can plate the circuit board by fusing the layers using chemicals.
Make the Design of the board for the further process. Used it as a blueprint of your PCB. Various software is available for this; when the Design is ready, print it using a plotted printer.
The outer layer of photoresist in the board is hardened by UV rays and removes the extra photoresist. Now the board is plated by a thin layer of copper. This acts as a guard of copper to protect it from etching.
Some chemical solution removes extra copper. Plating protects the required copper from the chemicals.
Clean the board before doing the solder mask. Commonly, the green part in the circuit board is a solder mask. UV rays can remove extra solder masks, and the required solder masks can be placed on the circuit board.
Important information is printed on the board by this process. After that, the last coating is needed on the board.
According to the requirements, soldering is further processed to give good quality of PCB. It upgrades the standards of the boards.
Electrical tests are mandatory to complete the process. An expert technician does this to test the overall quality. It is necessary to check that the boards are working appropriately or not.
PCB fabrication is the process of manufacturing or transforming bare boards into a structure based on the specifications provided in the circuit board design package.
Yes, we run the production for PCB Fab with consideration of capabilities and technical expertise.
We provide PCB Fabrication Services based on client request (domestic or off shore).
Yes, we provide a complete quotation with estimated delivery time for PCB fab services.
Yes, Based on Request, we provide coupon with the fabrication of PCBs.
Yes, we provide Solder sample (based on request).
Yes, we have a complete test procedure before PCB board is made. We will provide the test certification as well.
Yes, we give COC (Certificate of Conformance) with packing slip (Based on request).
Our standard turn around for production quantity is 4-6 week depends on materials availability.
Yes, we can stock the PCB boards.
Up to 6 oz Cu based thickness available for fabrication of PCBs.
Once we receive the all the details about your PCB Fabrication quote, we would review your quote, check about material availability, complexity of quotation, quantity of PCB fab, and then based on all the requirements, we provide our customers lead time of PCB fabrication.
Yes, we offer multi-layer PCB Fabrication with dense and high count multilayered PCB’s services.
Mostly we provide Green color. Also, we provide black, red, and blue colors as per the customer’s requirement.
You can email us at ibe@pcbaaa.com or call us at +86-75527629184 withing 7-8 days. We will provide the best possible option to you!
Our pre-production services typically include manufactures of 500 – 5,000 printed circuit boards per order with delivery times ranging generally from 2 to 20 days.
PCBs or Printed Circuit Boards are the most basic as well as necessary backbone of any modern gadget. You will find them virtually in every electronic gadget out there, be it smartphones, automobiles, or PCs, even medical equipment.
PCB fabrication is basically a process to manufacture printed circuit boards from raw or unrefined materials such as copper sheets, insulating substrates, and components.
This article will include steps necessary to consider before, during and after PCB fabrication. You will also get help in choosing the right PCB manufacturer and know about the factors influencing PCB manufacturing costs.
The method involved with creating a specially crafted PCB for electronic gadgets is known as PCB fabrication.
PCB fabrication involves designing a board layout, drilling holes, etching copper patterns, and soldering components to it. The process starts with the production of the printed circuit board (PCB) using a software program such as Eagle or Altium Designer. When the design is finished, it is moved to the fabrication.
1.Design of PCB
The design of the PCB is critical to the fabrication process’s success. The design should be created with a software program that allows for precise component placement and routing. It is critical to ensure that the design is precise and error-free, as any mistakes can result in a non-functional PCB.
2.Bill of Materials (BOM)
The PCB BOM or Bill of Materials is a detailed list of all the components required for the PCB. The BOM includes information such as the part number, quantity, and cost of the manufacturer. Before beginning the fabrication process, the BOM ensures that all the necessary components are available.
3.PCB Specifications
Before fabrication can begin, the PCB specifications must be carefully considered. The PCB’s size and shape must be appropriate for the intended application. The number of layers required will be determined by the circuit’s complexity. The thickness of the board and the weight of the copper used will also have an impact on the PCB’s performance. Finishing requirements, such as solder mask type and surface finish, must also be considered.
4.PCB Fabrication Technique
PCBs can be made using a variety of techniques, including the subtractive method, additive method, and semi-additive method. Each technique has benefits and drawbacks, and the best technique should be chosen based on the desired outcome.
Let’s take a deep look into the entire PCB fabrication process in details.
1.Creating Circuitry Images
Circuitry images creation is the first part of PCB fabrication, which defines the path of the circuit. Current will flow between the components on the PCB using certain conductors, such as copper or aluminum and thin paths are created between the components. That’s called creating circuitry images. This can be done in two ways:
2.PCB Layer Designing
The layout of the circuit board is designed using specialized software such as Eagle, Altium, or KiCAD. The software serves as a platform for arranging components, routing traces, and connecting them electrically. Once the design is complete, the design files must be output in a format that can be used to create the PCB.
3.Creating Inner Layer Circuitry
The layers of copper that are sandwiched between layers of insulation material, such as fiberglass, to form a multilayer PCB are referred to as the inner layer. Several steps are usually involved in the inner layer preparation process, including cleaning & preparing copper foil, applying photoresist, UV treatment, etching, and stripping.
4.Laminating The Layers
After the inner layers have been prepared, they are laminated together with layers of insulation material, such as fiberglass, under heat and pressure to form a multilayer PCB.
5.Drilling The Holes
Drilling is typically done with a CNC drilling machine that is programmed to drill holes at specific locations on the PCB. The drilling machine holds the drill bits on a spindle and moves the PCB in the x, y, and z directions.
6.Creating Top & Bottom Layer Circuitry
One of the final tasks include topmost and bottommost layers’ circuitry design, which is required if you go for multi-layer PCBs. This is similar to initial circuitry designs, but outermost circuitry designs are completed in the latter stages.
7. Solder Mask, Silkscreen, & Surface Finishing
A PCB solder mask is a protective layer applied to the surface of a printed circuit board to protect the copper traces from damage during soldering. Solder masks are typically made of polymer and applied via a silkscreen process. The solder mask is cured with UV light and then tested to ensure proper adhesion to the PCB surface.
PCB silkscreen is a method of applying text, labels, and other graphics to the surface of PCB. A stencil mesh is used to apply silk screens. To create the desired pattern ink is forced through the mesh onto the surface of PCB.
Finally, the surface finish is intended to safeguard the copper from oxidizing and corroding.
8. Assembly, Inspection and Testing
The PCB fabrication is completed by assembling all the layers to make single PCB. The inspection is an important step to ensure that the PCB fabrication was completed without any manufacturing defects.
Moreover, before the PCB is released for production, it must be thoroughly tested. Various testing methods, such as automated optical inspection (AOI), in-circuit testing (ICT), and functional testing, can be used.
Consider the following factors when choosing a PCB manufacturer:
1.The PCB manufacturer must possess the resources and knowledge needed to create the required PCB.
2.To ensure that the PCBs meet the required specifications, the manufacturer should have a stringent quality control process in place.
3.The PCB fabrication lead time should be reasonable and within the timeframe specified.
4.For the fabrication of the PCB, the manufacturer should offer a competitive price.
5.The right PCB fabrication and manufacturer will always give you clear quotations and will never change the prices halfway during the order fulfillment.
IBE Electronics is one such solution for PCB fabrication requirements. With decades of experience and expertise in the industry, there’s nothing related to PCB fabrication that IBE Electronics cannot take care of.
IBE Electronics has emerged as a friendly PCB fabrication guide to small scale industries, large scale industries, and startups by giving healthy, honest, and friendly advice to the clients. If you have any PCB fabrication requirements, then there’s no better option than IBE Electronics.
There are several factors that govern a PCB fabrication cost:
1.Conductive Materials Used: PCB using copper as a conductive material will be costlier than those using aluminum.
2.Number of layers in your PCB: If your PCB fabrication consists of several layers, then the cost will increase due to raw materials, adhesive, assembling complexities, etc.
3.Number of components: If the components are difficult to assemble, PCB fabrication costs will rise.
4.Drills and vias: If there are several holes needed to be drilled, that will add to the PCB fabrication cost.
5.Plated/non-plated vias: Plated vias are the reason for added cost, while non-plated vias are usually cheaper.
6.Lamination: While lamination is preferred in PCB fabrication, it’s still an optional part, and you can cut on the cost by opting out of lamination of your PCB fabrication.
Overall, the PCB fabrication process is complicated and necessitates extreme precision and attention to detail. By carefully preparing and considering the above factors it is possible to create a high-quality PCB that meets all the required specifications and performs reliably over its lifetime. You can directly reach out to IBE Electronics for the best PCB fabrication at the most reasonable prices.
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