LG Innotek, Korea’s first electronic components company founded in 1970, has grown into a leading global materials and components company by intensively fostering world- class products through continuous technological development and process innovation.
LG Innotek Announced on February 15th that the company has begun to strengthen its market penetration by introducing “2-Metal COF”, an essential product for XR equipment, and launched the product at the International Consumer Electronics Show ( CES).
COF (Chip on Film) is a semiconductor package substrate that connects the display and the main printed circuit board. It helps minimize display bezels and miniaturizes modules in electronic devices such as TVs, laptops, monitors and smartphones. Since microcircuits must be formed on very thin films, requiring a high level of technology, it is also known as an ultra-fine flexible circuit board, which can replace the existing flexible printed circuit board (FPCB).
COF can only form circuits on one side of the film, while “2-Metal COF” forms a large number of fine circuits on both sides of the film and allows electrical signals to travel faster between devices, thereby supporting its high-definition processing screen image.
According to LG Innotek, the product has a via hole size of 25μm. Considering that the thickness of human hair is 100 μm, the through hole is about a quarter of the thickness of a human hair. The smaller the via hole, the more channels connecting the upper and lower surfaces of the product, and the more graphic circuits through which the electrical signal passes.
Recently, with the official beginning of the metaverse era, the demand for bendable or foldable displays has increased, and the demand for flexibility of components mounted on them has increased, which is why “2-Metal COF” that can be bent freely is considered to be one of the products that fits the current display industry trend.
Improve user immersion by supporting high-resolution displays
LG Innotek’s “2-Metal COF” can form more than 4,000 circuits on both sides by combining thin films. Generally speaking, the more pattern circuits, the better the pixels. If pixels are improved, it will be possible to create XR devices that offer a high degree of immersion. If the virtual image displayed through the XR device has a low resolution, it will appear like viewing the image through a mosquito net (screen door effect). LG Innotek has continuously improved the specifications of “2-metal COF” since 2016 to minimize the screen door effect and support ultra-high resolution.
In particular, LG Innotek reduced the width of the pattern circuit to a pitch of 16μm by adopting a new process method. The width of the pattern circuit was reduced to the narrowest level in the industry from the original 18μm. As the circuit width decreases, the number of patterned circuits that can be accommodated on the COF surface increases, so users can see images with better quality even on the same size display.
In fact, IT manufacturers are increasingly adopting high-quality displays with minimal bezels to demonstrate the competitiveness of their devices. Manufacturers used to use chip-on-glass (COG), the technology behind display drives. COG is a technology that places a chip on top of a display, but since it cannot be expected to be flexible, it does not meet the current trend of “bezel-less” and “flexible” in the display industry. Therefore, “2-Metal COF” that stably supports high pixel count while shrinking the display frame is attracting attention.
Thin and flexible, free design
LG Innotek’s “2-Metal COF” is a thin and flexible film type that can be folded or rolled freely. In addition, it bends more smoothly than conventional COFs, and the film thickness is only 70 μm, the thinnest among semiconductor substrates. Usually, the thickness of the substrate for semiconductor packaging is 150 μm or more. As a result, the installation space for parts can be reduced, and the assembly company can secure space for placing more parts. It can even help design further optimizations for XR devices.
Reducing the thickness helps to improve the flexibility and thinness of the finished product, which has the advantage of increasing the design freedom of the display panel manufacturer. Regular consumers will also be able to encounter products that are more fully designed than existing XR devices.
2-Metal COF ushers in the XR era with wide applications
LG Innotek is focusing on technology upgrades to widen the gap with competitors, while launching aggressive promotions targeting North America and Japan, where there are many XR device makers.
The high-density circuit realization technology of “2-Metal COF” is applied as an alternative technology for products that are difficult to handle with flexible circuit boards, and it is also being developed and applied to new products such as Micro LED.
“LG Innotek will lead the ‘2-Metal COF’ market based on the technical strength and quality that has led the substrate business for 50 years, and will create differentiated customer value through products suitable for various applications,” said the director of the substrate material business department.
Package substrates are essential components in electronic devices that provide a stable base for mounting and connecting integrated circuits (ICs). They serve several key functions:
Electrical Connections: Package substrates facilitate the electrical connections between the IC and the external circuits. They typically include conductive pathways, or traces, that transfer signals and power.
Mechanical Support: They offer structural support for the IC, helping to secure it in place within the device. This is crucial for ensuring reliability and longevity in various operating conditions.
Thermal Management: Package substrates help dissipate heat generated by the IC during operation. Effective heat management prevents overheating and ensures stable performance.
Insulation: They provide electrical insulation between different components and layers within the package, preventing short circuits and ensuring safe operation.
Integration and Miniaturization: Modern package substrates are designed to support complex and densely packed circuitry, allowing for the integration of multiple functions in compact spaces.
Common materials used for package substrates include ceramics, epoxy resins, and advanced composites. The choice of material and substrate design depends on factors such as the required electrical performance, thermal conductivity, and mechanical strength.
PCB (Printed Circuit Board) and package substrates serve different roles in electronic devices, although they share some similarities. Here’s how they differ:
Function and Purpose:
PCB: A PCB provides the foundational platform for assembling and connecting electronic components. It includes conductive paths (traces), mounting pads, and vias to create the circuit layout for the entire device. PCBs are used to build complex circuits and are found in everything from consumer electronics to industrial machinery.
Package Substrate: A package substrate is specifically designed to support and connect integrated circuits (ICs) within a semiconductor package. It acts as an intermediary between the IC and the PCB, providing electrical connections, mechanical support, and thermal management for the IC.
Design Complexity:
PCB: Typically involves multi-layered boards with various circuit paths and connections that form the complete electronic system. PCBs can be single-sided, double-sided, or multi-layered, depending on the complexity of the circuit.
Package Substrate: Generally focuses on the specific needs of the IC it supports. It includes fine-pitched traces and sometimes complex patterns for high-density interconnects. Its design is tailored to the IC’s requirements and the overall package architecture.
Material and Construction:
PCB: Common materials include fiberglass-reinforced epoxy (FR4) or flexible polymers. The construction involves layering these materials with copper traces to create the circuit pathways.
Package Substrate: Often made from high-performance materials like ceramics or advanced composites that offer superior thermal and electrical properties. It typically has a multi-layered structure with a focus on precise interconnections for the IC.
Applications:
PCB: Used for a wide range of applications, including consumer electronics, automotive systems, and industrial equipment. It forms the main platform for circuit assembly in most electronic devices.
Package Substrate: Used primarily within semiconductor packages, such as for microprocessors, memory chips, and other ICs. It ensures reliable operation and performance of the IC by providing electrical and thermal connections.
The substrate of chip packaging is a crucial component that provides the physical support and electrical connections for an integrated circuit (IC) within its package. It acts as the intermediary between the IC and the external circuit board (PCB).
Electrical Connections: The substrate contains conductive pathways that link the IC’s pins or bumps to the external PCB. These connections facilitate the transfer of electrical signals and power between the IC and the rest of the electronic system.
Mechanical Support: It provides structural stability for the IC, helping to secure it within the package. This support is essential for maintaining the integrity of the IC during operation and handling.
Thermal Management: The substrate helps manage heat generated by the IC. Materials used in the substrate often have good thermal conductivity to dissipate heat away from the IC, preventing overheating and ensuring reliable performance.
Insulation: It provides electrical insulation between different layers and components within the package, which helps prevent short circuits and ensures safe operation.
Materials: Common materials for substrates include ceramics, epoxy resins, and advanced composite materials. The choice of material depends on factors such as the required electrical performance, thermal management needs, and cost considerations.
In the context of semiconductors, the substrate is the foundational material upon which semiconductor devices, like integrated circuits (ICs), are built.
Base Material: The substrate serves as the base layer for constructing semiconductor devices. It is typically made from materials such as silicon, which provides a stable platform for the creation of electronic components.
Electrical Properties: It influences the electrical characteristics of the semiconductor device. The choice of substrate material can affect the performance, including the speed and efficiency of the device.
Mechanical Support: The substrate offers physical support for the semiconductor structures and circuitry. It ensures the structural integrity of the device during manufacturing and operation.
Thermal Management: It helps in dissipating heat generated by the semiconductor components. Effective thermal management is crucial to maintain performance and prevent overheating.
Fabrication Process: During manufacturing, various layers of material are deposited and processed on the substrate to create the intricate patterns and structures necessary for the functioning of the semiconductor device.
In semiconductor manufacturing, both "substrate" and "wafer" refer to the foundational material used to build and process electronic devices, but they have specific roles:
Wafer: A wafer is a thin, flat slice of semiconductor material, usually silicon, used as the base for fabricating integrated circuits (ICs) and other electronic components. Wafers are produced by slicing a cylindrical piece of silicon, called a boule, into very thin discs. These wafers undergo various processes, including doping, etching, and deposition, to create complex electronic circuits.
Substrate: The term substrate can refer to the broader material layer or base upon which semiconductor devices are built. In the context of wafers, the wafer itself serves as the substrate for the semiconductor device fabrication. Additionally, in other contexts, "substrate" can refer to the base material in different types of electronic packaging, where it supports and connects the semiconductor components.
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Last updated on August 22nd, 2024 at 03:04 am