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eMMC Chip – Features and PCB Manufacturability Design

The eMMC chip is an embedded multimedia card (Embedded MultiMediaCard) chip that integrates a flash memory and a controller. It is mainly used in mobile devices, such as mobile phones and tablet computers, and can be used to store operating systems, applications, data and images, etc. Whether the eMMC chip supports a specific function depends on the specifications and design of the controller and flash memory chip.

Table of Contents
What is eMMC

Main features of eMMC chip

eMMC Chip
eMMC Chip

Highly integrated

The eMMC chip integrates a controller for managing the flash memory chip, which simplifies the product design process and accelerates product introduction.

Unified interface

eMMC adopts the MMC standard interface, which can be matched with a variety of storage devices, including NAND storage devices and MMC devices.

Larger capacity

The common capacity of eMMC is 2~256GB, which can meet the user’s demand for large-capacity storage.

High speed transmission

eMMC chips support higher data transfer rates, up to 400MB/s or higher, depending on their version and specification.

Strong compatibility

eMMC chips are compatible with a variety of mobile devices and computer systems, including Windows, Mac, Android, and more.

Pins of eMMC chip

eMMC Chip Pins
eMMC Chip Pins

The eMMC chip is a solid-state flash memory card, and its pin definition is slightly different from that of a general SIM card or SD card. Therefore, when using it, it needs to be modified appropriately according to the specific hardware device and chip specifications. At the same time, due to the wide application of eMMC chips in mobile devices, understanding their pin definitions and working principles is also helpful for better data communication and operation. Taking KLM8G1GETF as an example, briefly introduce its pins:

VCC/VCCQ

VCC is the pin that supplies power to the flash memory power supply, generally 3.3V; VCCQ is the pin that supplies power to the memory controller.

CLK

Clock input pin, sent by the main processor, enters the eMMC chip.

DATA Strobe

Data strobe pin, the strobe signal sent by eMMC to the main processor, in HS400 mode, read data and CRC response are synchronized with data strobe.

DATA0-DATA7

Data bus, bidirectional data transmission mode “pull-up”, eMMC defaults to 1-bit mode, and 4-bit or 8-bit can also be used.

RSTN

The reset pin is active at a low level, so generally a resistor will be pulled on the pin, and the default high level will not be reset.

CMD

Bi-directional signal for device initialization and command transmission, commands operate in two modes, open drain for initialization and push-pull for fast command transmission.

PCB design of eMMC chip

eMMC Chip Design
eMMC Chip Design

The PCB design of the eMMC chip needs to take into account many aspects, including power supply and interface, layout and routing, protection, heat dissipation, testing and debugging, etc., to ensure the performance and reliability of the eMMC and meet the requirements of the device.

Power and ground

Make sure stable power and ground lines for the eMMC chip. The power line should be wide enough to withstand the chip’s power consumption requirements, and the length and impedance of the power line should be minimized.

Signal line length matching

The length of the signal line of the eMMC chip should match as much as possible to reduce the delay and distortion of signal transmission, and differential pairs can be used to improve the anti-interference ability of the signal.

Signal line routing

Try to avoid signal lines crossing with high-power lines or high-frequency lines to reduce interference. You can use ground planes and power planes to isolate signal lines.

Capacitance and inductance

Add appropriate capacitors and inductors to the power and ground of the eMMC chip to provide stable power and ground. The selection of capacitors and inductors should be in line with the chip manufacturer’s recommendations.

PCB layout

Place the eMMC chip far away from other high-power or high-frequency components to reduce interference, and at the same time minimize the length of the signal line to improve signal stability.

Pin distance outlet method

Because the pin spacing of the eMMC device is relatively small, if the pins inside cannot go out, the following methods can be adopted:

① When the conventional wiring cannot be routed, the tight wiring can be adopted, that is, the minimum line width is used between the pad and the pad;

② If the wiring cannot be traced according to the minimum line width, you can also modify the pad and change the pad to an ellipse to meet the spacing of the minimum line width;

③ When it is really impossible to route the wires, it is possible to drill blind holes on the pads and change the layer routing.

Design for manufacturability of eMMC Chips

Line width and spacing

The minimum line width and line spacing is generally 3mil, and the design of the minimum line width and line spacing needs to meet the process requirements. If the minimum line width and line spacing exceeds the manufacturing capacity, the PCB board cannot be produced, or the produced board has a low yield rate and a very high cost.

Pad size

The size of the pad affects the welding quality. The pad is too small or even unsolderable. The minimum pad is generally 0.2mm. The production of a pad smaller than 0.2mm may cause the pad to be etched and the board will be scrapped.

Plate hole

The hole in the board refers to the hole on the SMT patch pad. The hole in the board generally needs resin plugging, and copper is plated on the hole to meet the welding requirements. If the hole in the board does not have a resin plug hole, the small welding area will lead to poor welding.

FAQ

The eMMC chip is an embedded multimedia card (Embedded MultiMediaCard) chip that integrates a flash memory and a controller. It is mainly used in mobile devices, such as mobile phones and tablet computers, and can be used to store operating systems, applications, data and images, etc. Whether the eMMC chip supports a specific function depends on the specifications and design of the controller and flash memory chip.

  • Highly integrated
  • Unified interface
  • Larger capacity
  • High speed transmission
  • Strong compatibility
  • Line width and spacing
  • Pad size
  • Plate hole

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