Direct plating copper(DPC) process is a method for preparing high-density electronic packaging materials. This process is the main method for metal film deposition in microelectronics manufacturing. It mainly uses surface deposition processes such as evaporation and magnetron sputtering to metallize the substrate surface. First, titanium is sputtered under vacuum conditions, then copper particles, and finally thickened by electroplating, then the circuit is made by ordinary PCB technology, and finally the thickness of the circuit is increased by electroplating/electroless plating deposition.
Through the above steps, the direct plating copper process can prepare a substrate with high thermal conductivity, excellent dimensional stability and reliable electrical properties. This substrate is often used in high-power electronic devices, radio frequency (RF) circuits, microwave devices, LED lighting and other fields to meet the heat conduction and signal transmission requirements of high-performance electronic devices.
What are the advantages of direct plating copper (DPC) process?
The direct plating copper process has the following advantages:
Excellent thermal conductivity: The DPC substrate uses ceramics as the base material, which has good thermal conductivity, can effectively conduct and dissipate the heat generated by high-power electronic devices, and improve the reliability and performance of the device.
Superior high-frequency characteristics: DPC substrates have low dielectric constant and dielectric loss, and can achieve low signal transmission loss in high-frequency and microwave frequency bands, making them suitable for high-frequency and radio-frequency applications.
High-density packaging capability: DPC substrates have high circuit density and thin line width/fine line spacing capabilities, which can achieve a more compact circuit layout and higher circuit density, which is conducive to miniaturization and integrated design.
Excellent mechanical properties: DPC substrates have high mechanical strength and hardness, can resist environmental stresses such as vibration, impact and thermal expansion, and improve the reliability and durability of devices.
Good dimensional stability: DPC substrates have a low thermal expansion coefficient in high-temperature environments, can maintain good dimensional stability, and reduce the risk of mismatch and cracks caused by thermal stress.
Excellent welding performance: The copper film on the surface of the DPC substrate has good welding performance, which can realize reliable circuit connection and welding.
High reliability and durability: The material and structural design of the DPC substrate make it have high reliability and durability, which can meet the requirements of harsh working environments and long-term use.
Overall, direct plating copper combines the thermal conductivity and excellent circuit performance of ceramic substrates, which is suitable for electronic devices requiring high power, high frequency and high reliability, and provides an important material choice for the electronic packaging industry.
What are the applications of direct plating copper (DPC) process?
Direct plating copper process is suitable for many fields and applications, the following are some fields direct plating copper process is suitable for:
Communication and radio frequency (RF): DPC substrate is widely used in radio frequency power amplifiers, antennas, filters, wireless communication equipment, etc. Its low dielectric loss and good high-frequency characteristics enable it to meet high-frequency signal transmission and RF power requirements.
Power electronics: DPC substrate is suitable for manufacturing power electronic equipment such as power amplifiers, inverters, motor drivers, and electric vehicle chargers. Its excellent thermal conductivity and mechanical strength can effectively handle the heat and stress generated by high-power devices.
LED lighting: The high thermal conductivity of the DPC substrate makes it an ideal choice for LED lighting modules and packages. It can effectively dissipate heat and improve the luminous efficiency and lifespan of LEDs.
Automotive electronics: DPC substrate is widely used in automotive electronics, such as power modules of electric vehicles, battery management systems(BMS), and vehicle communication equipment. Its high-temperature stability and durability enable it to meet the requirements of the automotive environment.
High-temperature applications: Due to the good high-temperature stability and corrosion resistance of DPC substrates, it is suitable for high-temperature applications such as aerospace and gas turbine control systems.
These are just some examples of common application areas, in fact, direct plating copper can play a role in many other electronic devices that require high density, high thermal conductivity and high reliability. Specific application needs and requirements will determine whether the DPC process is suitable.
Direct Plated Copper (DPC) is the newest development in the field of Ceramic Substrate PCBs and using this method can result in copper thickness' ranging from 10um (≈ 1/3oz) to 140um (4oz). With DPC track printing and etching is then performed with the thin Copper allowing for very fine tracks and reduced undercutting.
- Excellent thermal conductivity
- Superior high-frequency characteristics
- High-density packaging capability
- Excellent mechanical properties
- Good dimensional stability
- Excellent welding performance
- High reliability and durability
- Communication and radio frequency (RF)
- Power Electronics
- LED lighting
- Automotive electronics
- High-temperature applications
