IBE enables the world’s best brands. Through our unrivalled customer-centric approach, we partner with leading companies in numerous markets to deliver solutions for their most complex challenges.

Gallery
Contacts

IBe Industry Building, ShenZhen, China

ibe@ibepcbaaa.com

+86-75581785031

Electronic manufacturing industry
Co-packaging technology for optical chip and electrical chip

With the rapid development of information technology and network technology, optical communication and electronic communication technology have also been widely used. In communication systems, optical chips and electrical chips are two very important devices, which can process and transmit optical signals and electrical signals.

With the development of technology, co-packaging technology of optical chips and electrical chips has gradually become an important packaging method. It can achieve rapid conversion and processing of optical signals and electrical signals, and has the advantages of small size, light weight, and high reliability , so it has been widely used in modern communication systems.

This article mainly introduces the main methods of co-packaging technology for optical chips and electrical chips, and analyzes and compares their advantages and disadvantages.

Table of Contents

Direct-co-packaging

Direct co-packaging refers to a method of directly packaging optical chips and electrical chips together. This packaging method has the advantages of simple structure and easy implementation. In direct co-packaging, hybrid packaging or three-dimensional packaging methods are usually used.

hybrid package

Hybrid packaging is a way of manufacturing optical chips and electrical chips on different packaging substrates and then connecting them together. In hybrid packages, optical fiber arrays or micro-optical systems are usually used to realize the input and output of optical signals. At the same time, the electrical chip is connected to the packaging substrate through wires or flexible circuit boards. The advantages of hybrid packaging are low manufacturing cost and easy implementation, but in high-frequency or high-temperature environments, signal distortion or errors may occur due to differences in the transmission paths of optical signals and electrical signals.

3D packaging

Three-dimensional packaging is a way of fabricating optical chips and electrical chips in different layers on the same packaging substrate. In three-dimensional packaging, micro-optical systems or optical waveguides are usually used to realize the input and output of optical signals. At the same time, the electrical chip is connected to different layers on the packaging substrate through wires or flexible circuit boards. The advantages of three-dimensional packaging are compact structure and easy implementation of high-speed signal transmission. However, compatibility issues between optical devices and electronic devices need to be solved during the manufacturing process, and the manufacturing cost is high.

Direct and Indirect co-packaging
Direct and Indirect co-packaging

Indirect co-packaging

Indirect co-packaging refers to a way of packaging optical chips and electrical chips on different packaging substrates, and then connecting them together. This packaging method has the advantages of high reliability and easy maintenance. In indirect co-packaging, two packaging substrates are usually connected together using mechanical or optical connections.

Mechanical connection

Mechanical connection refers to a method in which optical chips and electrical chips are packaged on different packaging substrates, and then they are mechanically connected together. The advantages of mechanical connection are low manufacturing cost and easy implementation, but it may lead to problems such as loose connection, vibration and falling off. Therefore, appropriate measures need to be taken in mechanical connections to ensure the reliability and stability of the connection.

Optical connection

Optical connection refers to a way of packaging optical chips and electrical chips on different packaging substrates, and then connecting them together through optical devices. The advantages of optical connections are fast transmission speed and high stability, but the compatibility issues between optical devices and electronic devices need to be solved during the manufacturing process, and the manufacturing cost is high. At the same time, appropriate measures need to be taken in optical connections to ensure the stability and reliability of the connection and avoid errors or distortion.

Summary

The co-packaging technology of optical chips and electrical chips is a very important technology in modern communication systems. In co-encapsulation technology, direct co-encapsulation and indirect co-encapsulation are the two most commonly used methods.

Direct co-packaging has the advantages of simple structure and easy implementation, but there may be problems such as signal distortion or errors. Indirect co-packaging has the advantages of high reliability and easy maintenance, but the manufacturing cost is high and the compatibility issues between optical devices and electronic devices need to be solved. In practical applications, appropriate co-encapsulation methods need to be selected based on specific needs. At the same time, attention needs to be paid to ensuring the reliability and stability of the connection during the manufacturing process to improve the performance and quality of the entire communication system.

Leave a comment

Your email address will not be published. Required fields are marked *