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electronic packaging
Chip-on-Board (COB) vs. Package-on-Package (PoP)

Chip-on-Board (COB) vs. Package-on-Package (PoP): Exploring Electronic Packaging Technologies

The ever-evolving landscape of electronic devices demands innovation in packaging technologies. Among the array of approaches available, two prominent methods stand out: Chip-on-Board (COB) and Package-on-Package (PoP). These techniques play pivotal roles in the assembly, functionality, and miniaturization of electronic components, each with distinct advantages and applications.

electronic packaging
COB Packaging vs SMD Packaging – What Is the Difference

COB packaging vs SMD packaging – what is the difference

In the realm of electronics, the packaging of components plays a crucial role in determining performance, size, and application possibilities. Two prevalent packaging methods, Chip on Board (COB) and Surface Mount Device (SMD), stand out for their distinct characteristics and applications. Understanding the differences between COB packaging vs SMD packaging is essential for engineers, hobbyists, and enthusiasts alike. Keep reading.