With the development of technologies such as AI servers, the demand for high-speed PCBs will further increase, and high-speed PCBs will become an important part of the future electronics industry. At present, high-speed PCBs have been widely used in data center switches, AI servers, and automotive intelligence.
According to data, the scale of China’s electronic components market has increased from 1.831 billion RMB in 2017 to 2.2095 billion RMB in 2021, with a compound annual growth rate of 4.8%. It is expected to reach 2.3769 billion RMB in 2023.
High-speed PCBs are mainly used in high-speed digital circuits, and it is necessary to ensure the integrity of signal transmission. Unlike high-frequency PCBs, when designing high-speed PCBs, more factors such as signal integrity, impedance matching, signal coupling, and signal noise need to be considered.
Microelectromechanical systems (MEMS) and sensors play an important role in ensuring the practicality and safety of autonomous vehicles, and their latest developments are critical to achieving sustainability.
PCB exposure equipment is a device that transfers pre-prepared circuit image information to copper substrates through photolithography technology. It is a comprehensive product integrating electrical automation, microelectronic control, mechanical design, optoelectronics, vacuum sealing, CCD alignment and other application technologies .
The printed circuit board is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. Now, the circuit breadboard only exists as an effective experimental tool, and the printed circuit board has become an absolute dominant position in the electronics industry.
In recent years, with the continuous expansion of photovoltaic demand and the rapid increase of photovoltaic installed capacity, the consumption of silver paste has increased, which in turn has driven up the price of silver. The original silver-clad copper technology may increase the cost. In order to achieve the ultimate “silver removal”, electroplating copper is undoubtedly a choice.
Epoxy molding compound is the most important encapsulation material and supports the development of the integrated circuit industry. More than 90% of integrated circuits use epoxy molding compound as the packaging material. The vigorous development of the packaging market is expected to drive the demand for epoxy molding compounds.
Medical PCB manufacturing faces a number of challenges as the medical industry’s demand for high-quality medical PCBs continues to grow. In the medical industry, accurate data and results are critical. Medical PCBs must undergo rigorous method validation to ensure their performance and accuracy.
In the future, the bottleneck of high-frequency and high-power electronic products is the electromagnetic radiation and heat generated by them. To solve it, more electromagnetic shielding and heat-conducting components will be considered during designing of electronic products. Therefore, the role of electromagnetic shielding and heat dissipation materials and devices will become important, and the demand will grow significantly.