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BGA PCB Assembly - What Is It And How To Solder On The Board

BGA PCB assembly is a complex process that requires the right tools, knowledge, and preparation. In this article, you’ll find all the information you need to get started on your BGA PCB assembly project.

Table of Contents

What is BGA PCB Assembly?

BGA PCB assembly is the process of soldering a Ball Grid Array (BGA) package onto a Printed Circuit Board (PCB). A BGA package is an integrated circuit with several surface-mounted, small solder balls connecting its internal connections to the board. The BGA package is placed onto the board and then heated to melt the solder, creating electrical connections between the BGA and the PCB. The process is more precise and reliable than other types of soldering, making it ideal for applications where higher levels of accuracy are required. In addition, BGAs are well-suited for use in environments with limited space, as they occupy a much smaller footprint than other packages.

Types of BGA PCB

Types of BGA PCB

1. Flip Chip BGA (FCBGA):
This type of BGA is soldered directly to the circuit board using a special process, eliminating the need for pins or leads.

2. Ball Grid Array (BGA):
BGA is one of the most commonly used types of BGA PCB assembly and consists of a grid of solder balls arranged in an array.

3. Land Grid Array (LGA):
This type of BGA is similar to BGA, but instead of having a grid of solder balls, it has lands made up of copper pads that serve as connection points.

4. Ceramic Ball Grid Array (CBGA)
Ceramic Ball Grid Array (CBGA) is a type of Ball Grid Array (BGA) package used in integrated circuits that consists of a ceramic substrate with an array of solder balls that provide electrical connections between the chip and the PCB.

5. Quad Flat No Lead Package (QFN):
QFN packages are small and low profile, making them ideal for use in portable devices. It has no leads but is still connected to the PCB via a grid of solder balls.

6. Tape BGA
This type of BGA uses tapes instead of solder balls to connect the components. This method can be used in various applications where space and cost are critical factors in the design.

7. Plastic Ball Grid Array (PBGA)
This type of BGA package uses plastic as the base material PBGA components provide reliable electrical performance and are well-suited for applications that require high levels of temperature, shock, and vibration resistance.

Merits and demerits of BGA PCB


1. The number of solder joints can be reduced by using a BGA PCB Assembly, as components are soldered to one another directly instead of through leads or connectors.

2. Because of the shorter connection paths between components, which result in lower inductance and capacitance, BGA PCB Assembly provides better electrical performance.

3. By eliminating the leads, there is less of a chance for shorts and opens on the PCB which makes it ideal for high-reliability applications.

4. BGA PCB Assembly allows higher component density, resulting in smaller and lighter end products.

1. Due to the dense components, BGA PCB Assembly is difficult to inspect and repair, requiring specialized tools and skills.

2. Heat dissipation may be an issue with densely populated BGA PCBs because of their high thermal resistance.

3. High-density BGA PCB Assembly boards can also be more susceptible to vibration and shock damage compared to conventional PCBs.

4. The assembly process can be time-consuming as components must be placed accurately on the board before soldering.

Where can BGA PCB assembly be used?

BGA PCB assembly is used in a variety of industries, including aerospace, medical, telecommunications, automotive, and consumer electronics. The small size and increased reliability of BGA components make them ideal for use in small spaces, and their ability to dissipate heat quickly makes them ideal for applications where cooling is important.

BGA technology has been used in consumer electronics such as computers and laptops, phones, and tablets for many years. Processors, memory chips, and other ICs requiring a high degree of performance and speed are frequently used in BGA packages. By combining multiple ICs into one package, engineers can save space on the PCB and increase signal integrity. BGA packages also offer increased I/O capability when compared to traditional packages such as QFPs (Quad Flat Packs).

In addition to consumer electronics, BGA components are used in industrial equipment and robotics. Automotive applications are another area where BGA technology is increasingly being used. For example, several new cars have integrated video cameras in the rearview mirror that use BGA packages for the processor.

Ball Grid Array (BGA) VS Land Grid Array (LGA)

Ball Grid Array (BGA) VS Land Grid Array (LGA)

1. BGA packages have solder balls on the underside of the package, while LGA packages have lands on the underside of the package.

2. BGA packages offer higher-density connections than LGA packages, allowing for more components in a smaller area.

3. BGA packages are generally more reliable than LGA packages as the solder joint is stronger and less prone to cracking.

4. BGA packages require specialized equipment and skills for rework, while LGA packages can be reworked with standard soldering equipment.

5. To achieve optimal thermal and electrical performance, BGA packages often need special thermal profiles, whereas LGA packages don’t.

How to test BGA assembly board?

How to test BGA assembly board

When it comes to testing, there are two main types of BGA tests you can use – Visual Inspection and X-Ray inspection.

● Visual inspection is usually done by trained technicians and is used to check for missing components, misaligned components, poor soldering, etc.

● On the other hand, X-ray inspection is more accurate and can detect defects that may not be seen with the naked eye, such as solder bridges, voids, and lifted pads.

The decision between visual inspection and X-ray inspection will depend on the complexity and size of your assembly. To ensure the best results, both should be used.

Factors that would affect PCB BGA assembly

Factors that would affect PCB BGA assembly

Here are some of the most important factors that can affect PCB BGA assembly:

1. Type of BGA: Different types of BGA components have different thermal and electrical properties. This means that each type of BGA should be treated differently during assembly.
2. Heat transfer and thermal management: When assembling a BGA component, proper heat transfer and thermal management are essential to ensure reliable results. The amount of heat required, as well as the amount of time spent heating the component, should be carefully monitored.
3. Soldering process: The BGA assembly process is impacted differently by various soldering processes. There can be a need for various soldering processes based on the type of component being assembled.
4. BGA re-balling: If an existing BGA component needs to be re-balled, this must be done with great care and precision in order to ensure reliable results. Re-balling requires special tools and processes that should only be handled by experienced professionals.

How to solder BGA on PCB board?

Solder BGA on PCB boards requires special techniques, tools, and components. It is important to choose the correct components when soldering BGA on a PCB board. Make sure that the solder balls have the same pitch as the BGA package. After that, attach the BGA package to the PCB board by lining up its pads with the corresponding ones there. Carefully inspect the components to ensure that they are correctly placed and secured on the PCB board.

Next, apply flux onto the board and then position the heat sink over the package. Now, you can start to solder the BGA package to the board by applying heat to the underside of the heat sink. Once the solder has melted and started to flow, you should remove the heat source and allow the solder to cool. Finally, check the joints to make sure that they are properly connected. If there are any issues with the connection, you may need to re-solder the joint.

How to clean the BGA package?

Cleaning a BGA package is an important part of the PCB assembly process. Any dirt or residue that is left on the board can lead to electrical shorts and decreased performance.

The most common cleaning method used for BGA packages is a chemical cleaning agent such as isopropyl alcohol. To clean the BGA package, place it into a bath of the cleaning solution and allow it to soak for a few minutes. Once soaked, use a brush or swab to scrub any dirt off of the surface of the BGA package. Be sure to avoid using hard bristles, as these can damage delicate circuitry. Allow the BGA package to air dry before continuing with the assembly process.


BGA PCB assembly is an important process for a wide range of industries. It’s important to understand the different types of BGAs and their uses, how to test and solder them, and how to properly clean them in order to ensure reliable and long-lasting BGA PCB assemblies. With the right knowledge and techniques, you can successfully create and maintain quality BGA PCB assemblies. For help with designing, assembling, and testing your BGA PCB assemblies, you can contact IBE Electronics. Their team of experts has the experience and knowledge needed to create high-quality products that meet your needs.


BGA PCB assembly is the process of soldering a Ball Grid Array (BGA) package onto a Printed Circuit Board (PCB). A BGA package is an integrated circuit with several surface-mounted, small solder balls connecting its internal connections to the board.

1. Type of BGA
2. Heat transfer and thermal management
3. Soldering process
4. BGA re-balling

Cleaning a BGA package is an important part of the PCB assembly process. Any dirt or residue that is left on the board can lead to electrical shorts and decreased performance.

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