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Hi, I am Ruth. Based on extensive studying and working experience in electronic, PCB and related industry, I am proficient in electronic components, PCB production process and assembly technology. It's my honer to share with you the professional knowledge of PCB, PCBA and related industry through my articles. If you have any demands about PCB such as design, manufcturing and assembly, I would like to provide you the most effective views and suggestions.
Electronic manufacturing industry PCB/PCBA knowledge
package substrate - A comprehensive exploration

Package substrate – A comprehensive exploration

The package substrate provides electrical connection between the chip and different circuits of the conventional PCB, and provides protection, support, heat dissipation channels for the chip, and achieves the effect of meeting the standard installation size. With the development of technology, semiconductor package substrates in the form of BGA, CSP and flip-chip (FC) have rapidly expanded their application fields in recent years.

Electronic manufacture ranking
10 companies in the optical transceiver industry chain 2023

10 companies in the optical transceiver industry chain 2023

The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. To help you choose the best partner, this article will analyze and introduce 10 companies in the optical transceiver industry chain for you.

electronic components and devices Electronic manufacturing industry
A complete overview of chip lithography process

A complete overview of chip lithography process

In the modern society, the demand for chips is very large, and chip lithography is the most important, complex and expensive process in the chip manufacturing process. Its precision determines the manufacturing process of the chip and the performance of the device. So, a deep understanding of chip lithography process plays a vital role in chip manufacturing.

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Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical modules, one of the hot spots of capital market hype this year, may be second only to AI in popularity. The concept of hype is “CPO”, that is, photoelectric co-packaging technology. This technology is expected to achieve low energy consumption and high energy efficiency in high computing power scenarios, and provide better computing power infrastructure for AIGC (AI generated content) applications such as ChatGPT.

Electronic manufacturing industry PCB/PCBA knowledge
Micro packaging technology(MPT) - A new-generation assembly and packaging technology

Micro packaging technology (MPT) – a new-generation assembly and packaging technology

Micro packaging technology is a high-density electronic assembly technology. With the rapid development of miniaturization, light weight, high operating frequency and high reliability electronic products, electronic components have gradually entered the development stage of high density, high function, miniaturization, multi-pin and narrow spacing. In this context, micro packaging technology (MPT) emerged as a new generation of advanced electronic assembly and packaging technology.

News
PCB develops towards HDI - from single-layer to substrate-like PCB (SLP)

PCB develops towards HDI – from single-layer to substrate-like PCB

HDI is the abbreviation of high density interconnector, which is a circuit board with a relatively high circuit distribution density using micro-blind buried hole technology. From mobile phones to small portable products such as smart weapons, HDI technology can make the design of terminal products more miniaturized, while meeting higher standards of electronic performance and efficiency.