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Hi, I am Ruth. Based on extensive studying and working experience in electronic, PCB and related industry, I am proficient in electronic components, PCB production process and assembly technology. It's my honer to share with you the professional knowledge of PCB, PCBA and related industry through my articles. If you have any demands about PCB such as design, manufcturing and assembly, I would like to provide you the most effective views and suggestions.
PCB/PCBA knowledge
Understanding solar light circuit boards - How to make solar lamp circuits

Understanding solar light circuit boards – How to make solar lamp circuits?

A recent study showed that 60% of American Homeowners would choose a renewable energy source. This renewed interest in solar energy has thrust the market into the limelight.

Solar light circuit boards are essential components of solar lights. They convert sunlight into electrical energy, which powers the light. Solar light circuit boards are made up of a variety of components like solar cells, resistors, capacitors, and transistors.

Electronic manufacturing industry
Advanced optical packaging – how much do you know

Advanced optical packaging – how much do you know ?

In recent years, the rapid development of application markets such as big data, cloud computing, 5G, IoT, and artificial intelligence has led to explosive growth in data traffic. Data centre interconnection has become a significant area of research in optical communications, with optical transceivers playing a vital role in optical communication systems. In this article, I will systematically introduce optical packaging, its importance, and its associated aspects.

Electronic manufacturing industry PCB/PCBA knowledge
Wafer Level Packaging (WLP) - A comprehensive guideline including FIWLP FOWLP

Wafer level packaging (WLP) – A comprehensive guideline including FIWLP, FOWLP

Wafer Level Packaging (WLP) is an advanced packaging technology. In recent years, with the development of more intelligent and sophisticated terminal applications such as mobile phones, computers, and AI, the demand for high computing power and highly integrated chips has increased. Therefore, advanced packaging technologies represented by Flip-Chip, 2.5D/3D IC package, wafer level packaging (WLP), and Sip are developing rapidly.

Electronic manufacturing industry PCB/PCBA knowledge
package substrate - A comprehensive exploration

Package substrate – A comprehensive exploration

The package substrate provides electrical connection between the chip and different circuits of the conventional PCB, and provides protection, support, heat dissipation channels for the chip, and achieves the effect of meeting the standard installation size. With the development of technology, semiconductor package substrates in the form of BGA, CSP and flip-chip (FC) have rapidly expanded their application fields in recent years.

Electronic manufacture ranking
10 companies in the optical transceiver industry chain 2023

10 companies in the optical transceiver industry chain 2023

The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. To help you choose the best partner, this article will analyze and introduce 10 companies in the optical transceiver industry chain for you.

News
Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical transceiver industry research – Why is 800G optical module a big node at the AI wave

Optical modules, one of the hot spots of capital market hype this year, may be second only to AI in popularity. The concept of hype is “CPO”, that is, photoelectric co-packaging technology. This technology is expected to achieve low energy consumption and high energy efficiency in high computing power scenarios, and provide better computing power infrastructure for AIGC (AI generated content) applications such as ChatGPT.