The package substrate provides electrical connection between the chip and different circuits of the conventional PCB, and provides protection, support, heat dissipation channels for the chip, and achieves the effect of meeting the standard installation size. With the development of technology, semiconductor package substrates in the form of BGA, CSP and flip-chip (FC) have rapidly expanded their application fields in recent years.
The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. To help you choose the best partner, this article will analyze and introduce 10 companies in the optical transceiver industry chain for you.
In the modern society, the demand for chips is very large, and chip lithography is the most important, complex and expensive process in the chip manufacturing process. Its precision determines the manufacturing process of the chip and the performance of the device. So, a deep understanding of chip lithography process plays a vital role in chip manufacturing.
Optical modules, one of the hot spots of capital market hype this year, may be second only to AI in popularity. The concept of hype is “CPO”, that is, photoelectric co-packaging technology. This technology is expected to achieve low energy consumption and high energy efficiency in high computing power scenarios, and provide better computing power infrastructure for AIGC (AI generated content) applications such as ChatGPT.
The optical module is one of the core devices of the optical communication system, and its development has a vital impact on its related industrial chain. So, what is an optical module? How to upgrade the upstream industry PCB of optical modules? And what are the main applications of optical modules?
Electronic technology tends towards miniaturization and complexity, PCB is also constantly upgrading to high precision, high density, high reliability, and miniaturization. HDI microvia PCB has also become a new trend in the development of circuit boards.
With the rapid development of miniaturization and complexity of electronic technology, precision, high density, high reliability, and miniaturization have become the general trend of printed circuit board development. Correspondingly, micro via in PCB also becomes a new trend in PCB layout design.
Micro packaging technology is a high-density electronic assembly technology. With the rapid development of miniaturization, light weight, high operating frequency and high reliability electronic products, electronic components have gradually entered the development stage of high density, high function, miniaturization, multi-pin and narrow spacing. In this context, micro packaging technology (MPT) emerged as a new generation of advanced electronic assembly and packaging technology.
Land Grid Array (LGA) is a type of electronic packaging technology used in computer processors and other high-performance integrated circuits. LGA technology offers several advantages over older packaging technologies, including higher pin density, improved electrical performance, better thermal management, and a smaller form factor.
HDI is the abbreviation of high density interconnector, which is a circuit board with a relatively high circuit distribution density using micro-blind buried hole technology. From mobile phones to small portable products such as smart weapons, HDI technology can make the design of terminal products more miniaturized, while meeting higher standards of electronic performance and efficiency.