With the continuous advancement of advanced packaging, the proportion of packaging and testing equipment in the semiconductor equipment industry has gradually increased. Die bonding is an important link in the post-process of semiconductor manufacturing. This article will introduce you in detail about die bonding techniques in semiconductor and die bonder machine.
A recent study showed that 60% of American Homeowners would choose a renewable energy source. This renewed interest in solar energy has thrust the market into the limelight.
Solar light circuit boards are essential components of solar lights. They convert sunlight into electrical energy, which powers the light. Solar light circuit boards are made up of a variety of components like solar cells, resistors, capacitors, and transistors.
In recent years, the rapid development of application markets such as big data, cloud computing, 5G, IoT, and artificial intelligence has led to explosive growth in data traffic. Data centre interconnection has become a significant area of research in optical communications, with optical transceivers playing a vital role in optical communication systems. In this article, I will systematically introduce optical packaging, its importance, and its associated aspects.
Wafer Level Packaging (WLP) is an advanced packaging technology. In recent years, with the development of more intelligent and sophisticated terminal applications such as mobile phones, computers, and AI, the demand for high computing power and highly integrated chips has increased. Therefore, advanced packaging technologies represented by Flip-Chip, 2.5D/3D IC package, wafer level packaging (WLP), and Sip are developing rapidly.
The package substrate provides electrical connection between the chip and different circuits of the conventional PCB, and provides protection, support, heat dissipation channels for the chip, and achieves the effect of meeting the standard installation size. With the development of technology, semiconductor package substrates in the form of BGA, CSP and flip-chip (FC) have rapidly expanded their application fields in recent years.
The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. To help you choose the best partner, this article will analyze and introduce 10 companies in the optical transceiver industry chain for you.
In the modern society, the demand for chips is very large, and chip lithography is the most important, complex and expensive process in the chip manufacturing process. Its precision determines the manufacturing process of the chip and the performance of the device. So, a deep understanding of chip lithography process plays a vital role in chip manufacturing.
Optical modules, one of the hot spots of capital market hype this year, may be second only to AI in popularity. The concept of hype is “CPO”, that is, photoelectric co-packaging technology. This technology is expected to achieve low energy consumption and high energy efficiency in high computing power scenarios, and provide better computing power infrastructure for AIGC (AI generated content) applications such as ChatGPT.
The optical module is one of the core devices of the optical communication system, and its development has a vital impact on its related industrial chain. So, what is an optical module? How to upgrade the upstream industry PCB of optical modules? And what are the main applications of optical modules?
Electronic technology tends towards miniaturization and complexity, PCB is also constantly upgrading to high precision, high density, high reliability, and miniaturization. HDI microvia PCB has also become a new trend in the development of circuit boards.