Integrated circuit, known as IC, chips, or microchips, is the foundation of most modern electronics technology. Chips are small as well as simplified design and manufacturing, for that they are manufactured on a single conductive piece of material. Today there are many companies that provide the full range of IC services from design through manufacturing. To assist you in your supplier search, we have compiled information of top 10 suppliers of integrated circuit design services in the world in this article.
A PCB BOM (Bill Of Materials) provides a comprehensive list of all the components needed for the PCB assembly, including their part numbers, descriptions, quantities, and other relevant information, which serves as the foundationg for PCB Manufacturing or PCBA. A well constructed PCB BOM is vital to result in quality products.
High-speed Printed Circuit Board (PCB) and housing materials are specially designed to manage electrical signals traveling through a circuit board at lightning-fast speeds while simultaneously dissipating the heat generated by devices during operation.
They are essential when designing circuit boards that can withstand the demands of high-speed data transmission. These materials have been specifically designed to meet the needs of modern electrical engineering projects with increased frequencies, higher speeds, and lower profile components. It is essential to carefully consider their characteristics to make the right choice for each application.
The global advanced IC substrates market value will grow from 15.8 billion USD in 2021 to approximately 29.6 billion USD in 2027, at a compound annual growth rate (CAGR) of 11%. This growth is mainly driven by the mobile and consumer, automotive and mobile sectors and driven by high demand in the telecom and infrastructure markets.
Engineers will consider the power integrity and signal integrity of the product during the layout process, but the manufacturability of silkscreen is easily overlooked. For example, the silkscreens cover the SMD pad, which brings inconvenience to the PCB continuity test and component soldering. If the silkscreen design is too small, it will cause difficulty in screen printing, but if it is too large, the silkscreen will overlap each other, making it difficult to distinguish, etc.
In 2022, China’s energy storage lithium battery shipments reached 130GWh, a year-on-year growth rate of 170%. As one of the core components of the electrochemical energy storage system, under the dual support of policies and market demand, the shipments of leading companies related to energy storage BMS have increased significantly. GGII predicts that by 2025, the market value of China’s energy storage BMS will reach 17.8 billion RMB, with a compound annual growth rate of 47%. Here are the top 10 energy storage BMS companies in China.
Why are circuit boards (PCBs) usually green? Many people are curious about this question. This question also has many different answers. Let’s take a look at why most PCBs are green. There are several accepted reasons.
With the rapid development of electronic products, there are many types of circuit boards, including rigid PCBs, flexible PCBs, and rigid-flex PCBs. Rigid PCBs are ordinary PCB boards that cannot be bent, and most products use PCBs. The flex PCB is a flexible board (FPC), which can be bent to a certain extent, and is generally used in products that are relatively thin or have bending requirements. But do you know any facts about rigid PCB vs flex PCB?
Currently, Mini LED displays are widely favored in markets such as TVs, IT displays, and automobiles. Statistics show that the global Mini LED market will grow to .32 billion USD by 2024, and 5.9 billion USD by 2025, with a compound annual growth rate of 86.6% from 2019 to 2025, of which Mini LED backlights will contribute the main market revenue.
The packaging substrate is a kind of electronic substrates that can provide electrical connection, protection, support, heat dissipation, assembly and other functions for chips and electronic components, so as to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization and high reliability.