With the rapid advancement of electronic technology and the increasing societal demands, electronic products are entering a new realm. They are evolving towards miniaturization, lightweight, high performance, multifunctionality, and cost-effectiveness. In this context, System in package (SiP) technology has emerged as a critical packaging solution, offering engineers a flexible design approach with notable advantages such as short cycle time, good compatibility, and low cost. To gain a comprehensive understanding of SiP and its applications, let’s delve into the details.
What is System in Package (SiP) short
SiP is a packaging technology where multiple electronic components, such as chips, passive elements, and even modules, are integrated into a single package. Unlike System on a Chip (SoC), which involves integrating components on a single semiconductor chip, System in Package allows for the integration of pre-packaged components. This flexibility enables the assembly of various types of components, offering enhanced functionality, improved performance, and reduced form factor.
The development of system in package (SiP)
The last few years have witnessed tremendous advancements in the System in Package technology. This advancement was propelled by the increased demands of the electronics industry for higher performance, functionality, and cost efficiency.
Consequently, various technologies have emerged, including:
●Multi-chip Module (MCM)
●2D SiP, 2.5D SiP
Each technology offers unique features and advantages, making System in Package a versatile packaging solution for different applications.
What are the advantages of system in package
The advantages of System in Package are manifold and contribute to its growing popularity among engineers and manufacturers. These advantages include:
a. Enhanced Functionality: SiP allows for the integration of diverse components within a single package, enabling the creation of complex systems with improved functionality.
b. Space Optimization: By integrating multiple components into a compact package, SiP helps optimize space utilization, making it an ideal choice for miniaturized electronic devices.
c. Improved Performance: The proximity of components in SiP reduces interconnect lengths, minimizing signal delays and improving overall system performance.
d. Design Flexibility: SiP offers engineers the flexibility to choose and integrate components based on specific design requirements, leading to faster prototyping and product development.
e. Cost Efficiency: SiP enables the use of off-the-shelf components, reducing manufacturing costs and time-to-market. Additionally, the integration of multiple components into a single package eliminates the need for additional interconnects and reduces assembly complexity.
What are the types of system in package
SiP technology encompasses various packaging approaches, including:
●Multi-chip Module (MCM) 2D System in Package: In this approach, chips are arranged in a two-dimensional manner on the same packaging substrate, resulting in a compact package.
●Stacked Die Module, Substrate Module, FcFBGA/LGA SiP, Hybrid SiP: These variations of SiP involve different methods of stacking and integrating chips, offering flexibility in design and functionality.
●2.5D System in Package: This technology involves integrating two or more die stacks into a single package using physical methods like interposers or interconnects.
●Antenna-in-Package System in Package: This type of SiP combines antenna functionality within the package, enabling space-efficient designs in wireless communication applications.
●3D System in Package: 3D SiP utilizes direct chip-to-chip stacking techniques, including wire bonding, flip chip, or a combination of both, to create a three-dimensional package structure.
The process and technical difficulties of SiP
System in Package packaging involves a specific process flow for manufacturing finished SiP chips. Let’s explore the process and understand how it differs from traditional electronic manufacturing processes.
In traditional electronic manufacturing processes, the flow typically includes steps such as solid crystal, wire bonding, molding, singulation, device testing, soldering, surface mount technology (SMT), board-level assembly, and system testing. However, with the miniaturization trend and the unique requirements of SiP technology, the process flow differs.
In System in Package packaging, the process flow includes high-precision surface mount technology (SMT), followed by molding and singulation (EMI) processes. The process ends with system testing. This streamlined flow reduces the number of steps and enhances the efficiency of SiP manufacturing.
SiP packaging is usually carried out on a large substrate, allowing for the production of tens to hundreds of SiP finished products on each substrate. This mass production capability further contributes to the cost-effectiveness of SiP technology.
System in Package (SiP) Technical Difficulties
While SiP offers numerous advantages, it also presents certain technical challenges that engineers must address during the manufacturing process. Some of these difficulties include:
1.To Clean: SiP packaging requires specialized cleaning equipment and cleaning solutions.
2.Ball Planting: The process of ball planting involves the placement of solder balls on the package for interconnection purposes. It requires careful selection of ball planting equipment, consideration of ball diameter, an inspection of sphere coplanarity, testing of ball grid arrays (BGAs), and adherence to flux residue requirements.
3.Substrate: SiP packaging involves the use of different substrates, such as ceramic or organic substrates. Designing and verifying ceramic substrates can be challenging due to their complex manufacturing process and higher processing costs. Organic substrates, on the other hand, often have poor thermal conductivity, which can lead to electrical connection failures at the IC soldering points.
What is the difference between SiP and SoC
While both System in Package and System on a Chip (SoC) involves integrating multiple components into a single package, they differ in their approach. SiP focuses on the integration of pre-packaged components, allowing for flexibility and versatility in component selection. In contrast, SoC involves integrating components on a single semiconductor chip, resulting in a tightly integrated system.
Also, while SiP is at home combining technologies, SoC is more useful to optimize the performance of a highly integrated solution.
What is the application of system in package
System in Package technology finds extensive applications across various industries. Some notable applications include:
1.5G Mobile Phone: SiP enables the integration of diverse components required for 5G connectivity, such as baseband processors, power amplifiers, and RF modules, within a compact package.
2.Vehicles: Automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and power management modules uses this technology.
3.Consumer Electronics: SiP packaging facilitates the integration of various functionalities in consumer electronic devices, such as smartphones, tablets, wearables, and smart home devices.
4.Medical Electronics: SiP technology plays a crucial role in the field of medical electronics. It enables the integration of complex systems within a compact package, ensuring the reliability and functionality of medical devices. SiP packaging is utilized in medical devices such as implantable devices, diagnostic equipment, monitoring systems, and drug delivery systems.
5.Military Electronics: SiP packaging is extensively employed in military and defense applications. It enables the integration of various components, such as processors, memory modules, communication modules, and sensors, in a compact and ruggedized package. SiP technology enhances the performance, reliability, and durability of military electronics, making it suitable for applications such as secure communication systems, surveillance equipment, radar systems, and unmanned aerial vehicles (UAVs).
6.High-Precision SMT Manufacturing: SiP packaging involves high-precision surface mount technology (SMT) processes, enabling the manufacturing of compact and highly integrated electronic systems. The precise placement of components, fine-pitch soldering, and advanced assembly techniques ensure the reliability and performance of SiP products. This makes SiP technology ideal for applications that require high-density interconnects, miniaturization and optimized electrical performance.
SiP Package Substrate
The package substrate is a critical component in SiP technology. It provides mechanical support, electrical connectivity, and thermal management for the integrated components. There are different types of package substrates used in SiP packaging:
Package Substrates Structural Classification:
●Rigid Substrate Material: Rigid substrates, such as ceramic and some organic materials, offer excellent mechanical strength and thermal conductivity. They are commonly used in SiP packaging where durability and high-temperature performance are crucial.
●Flexible Substrate Material: Flexible substrates, typically made of organic materials, provide flexibility and bending capabilities, making them suitable for applications that require conformal and flexible packaging.
Package Substrate Handling:
Handling package substrates requires careful consideration to maintain the integrity of the components and ensure proper alignment during assembly. Customized handling equipment and processes are employed to handle and transport the package substrates without causing damage or misalignment. Additionally, stringent quality control measures are implemented to verify the substrate’s mechanical properties, electrical connectivity, and thermal performance.
System in package (SiP) technology has emerged as a vital packaging solution in the electronics industry, offering numerous advantages. Such advantages include enhanced functionality, space optimization, improved performance, design flexibility, and cost efficiency. SiP enables the integration of diverse components into a single package, catering to the increasing demands for miniaturized, high-performance electronic systems.
With its wide range of applications in 5G mobile phones, vehicle electronics, consumer electronics, medical electronics, military electronics, and high-precision SMT manufacturing, SiP continues to drive innovation and shape the future of electronic packaging.
SiP is a packaging technology where multiple electronic components, such as chips, passive elements, and even modules, are integrated into a single package. Unlike System on a Chip (SoC), which involves integrating components on a single semiconductor chip, System in Package allows for the integration of pre-packaged components.
●Multi-chip Module (MCM) 2D System in Package
●Stacked Die Module, Substrate Module, FcFBGA/LGA SiP, Hybrid SiP
●2.5D System in Package
●Antenna-in-Package System in Package:
●3D System in Package
1.5G Mobile Phone
6. High-Precision SMT Manufacturing