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PCB/PCBA knowledge
5 technical requirements for PCB manufacturing

PCB manufacturing becomes essential for some electronics. Have you ever thought about how to attain high-quality PCB boards? In this article, we mainly discuss the factors of PCB manufacturing, including design requirements, material selection, processing technology, equipment conditions and quality control.

Table of Contents

Reasonable design

The design requirement of PCB board is one of the important factors affecting its manufacturing. PCB design should be reasonable, including some aspects such as layout, size and hierarchy . A reasonable PCB layout design can make the PCB wiring more concise and compact, and reduce the possibility of signal interference and crosstalk.

First of all, circuit functions need to be considered, including circuit stability, anti-interference ability and transmission speed.

Secondly, size requirements are also an important consideration in design, including the size, thickness and weight of the circuit board. Appropriate dimensions can meet the functional requirements of the board while taking into account the ease of fabrication and assembly.

Finally, PCB layout rules are also factors that need to be considered in the design, including line width, line spacing, aperture and pad size, etc. The rationality and accuracy of the design requirements will directly affect the performance and reliability of the circuit board. The design of the hierarchical structure should be reasonable, so that circuits with different functions can be laid out in layers to improve the maintainability and scalability of the circuit board.

PCB manufacturing process

Appropriate material selection

As one of affecting factors, the material selection of PCB circuit board plays a critical role in PCB manufacturing. The material selection of the circuit board should be appropriate, including the substrate material and the thickness of the copper clad layer.

First of all, the choice of substrate material is the key. Common substrate materials include FR-4, aluminum substrate and ceramic substrate. Different substrate materials have different thermal conductivity, mechanical strength and electrical properties. It is necessary to select the appropriate material according to the specific application scenario.

Secondly, the selection of conductive layer and protective layer is also an important consideration. Common conductive layer materials include copper and silver, etc. Usual protective layer materials include solder paste and solder mask.

The thickness of the copper clad layer should be determined according to the power consumption and signal transmission requirements of the circuit board. Generally, there are options such as 1oz and 2oz.

The selection of material will directly affect the electrical conductivity, heat resistance and anti-corrosion performance of the circuit board.

Processing technology

The manufacturing process of circuit boards should be fine. The common processing processes involve PCB printing, PCB etching, PCB drilling and PCB welding.

First of all, the printing process is a key step in printing circuit patterns on the substrate, and factors such as printing accuracy and printing speed need to be considered.

Secondly, the etching process is a step of etching away the redundant conductive layer. It is necessary to consider the selection of etching solution and the control of etching time. The drilling process is the step of drilling holes into the substrate, and we should take drilling accuracy and drilling speed need into consideration. The drilling process must ensure the accuracy of the hole diameter and the smoothness of the hole wall for subsequent plug-in and welding processes.

Finally, the soldering process is the step of soldering components to the circuit board. Soldering temperature and soldering time become important in this process. The rationality and stability of the processing technology will directly affect the quality and reliability of the circuit board.

Equipment conditions

Equipment conditions
Equipment conditions

The effect of equipment conditions are also a key factors to consider for PCB board manufacturing. First of all, the accuracy and stability of equipment are the key factors affecting the quality of production, including devices such as printing machines, etching machines, drilling machines, and welding machines.

The accuracy and stability of the equipment will directly affect the dimensional accuracy and electrical performance of the circuit board. Secondly, the degree of automation of equipment is also a factor that needs to be considered. Automation equipment can improve production efficiency and product quality. The rationality and advancement of equipment conditions will directly affect the production efficiency and competitiveness of circuit boards.

Strict quality control

The quality control of PCB boards must be strict including inspection and testing. The inspection process should check the key links in the manufacturing process to ensure that each step meets the requirements. The testing process requires functional testing and reliability testing of the finished PCB board to ensure its performance and reliability.


Reasonable design requirements, appropriate material selection, stable processing technology, strict quality control and advanced equipment conditions will directly affect the quality and performance of the circuit board.

Therefore, when making a PCB circuit board, these factors need to be considered comprehensively to ensure the quality and reliability of the circuit board.

  • Creating Circuitry Images
  • PCB Layer Designing
  • Creating Inner Layer Circuitry
  • Laminating The Layers
  • Drilling The Holes
  • Creating Top & Bottom Layer Circuitry
  • Solder Mask, Silkscreen, & Surface Finishing
  • Assembly, Inspection and Testing


  • Work experience in the industry
  • Required certifications and qualifications
  • Customer satification
  • Time delivery

Reasonable design requirements, appropriate material selection, stable processing technology, strict quality control and advanced equipment conditions.

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