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Electronic manufacturing industry
Seven common defects of BGA packaging welding

Seven common defects of BGA packaging welding

BGA (Ball Grid Array) packaging is a surface-mount packaging method, which has been widely used in the electronics industry for its high density and high performance. However, during the BGA package soldering process, various defects and abnormalities may occur. Let’s take a look at these common problems and their causes. https://www.youtube.com/watch?v=2eXMFIkdA0o Solder ball breakage Virtual […]