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What is the relationship between the IGBT package and solder paste layer void

What is the relationship between the IGBT package and solder paste layer void?

As an important core device of power electronics, IGBT’s reliability is the most important factor in determining the safe operation of the entire device. Since the IGBT adopts stacked packaging technology, this technology not only improves the packaging density, but also shortens the interconnection length of the wires between chips, thereby improving the operating speed of the device. What is the relationship between the IGBT package and solder paste layer void? In this article, you can find the answer.