With the rapid development of science and technology, all kinds of electronic products have put forward higher requirements for PCB and package substrates. IC substrate is a kind of intermediate product of communication chip and circuit board, which is the key component of IC packaging process.
In order to better meet your needs, this article will introduce you top 8 IC substrate suppliers in china.
What is IC substrate?
IC substrate (ICS) is a kind of intermediate product of communication chip and circuit board, can be connected by its internal circuit chip and circuit board, as the key component of IC packaging process. It is helpful to achieve high density, high precision, miniaturization and thinning of products.
2023 top 8 IC substrate suppliers in china
Fastprint
Headquarters: Guangdong, China
Established time: 1999
Company website: https://www.chinafastprint.com
Fastprint, committed to becoming a global leader in digital manufacturing of advanced electronic circuit solutions, is the largest professional printed circuit board prototype manufacturer in China. Fastprint’s leading products are PCB prototypes and small batch boards, and its business mainly involves the design, production, sale of double-side PCB and multilayer printed circuit boards and the import and export business of related products.
In 2012, double-side invested in the construction of Integrated Circuit Package Substrate Construction Project, aiming to build an integrated circuit package substrate production line, which is positioned as a high-end IC substrate (FC substrate ) manufacturing, supplemented by the manufacturing of mid-end integrated circuit packaging substrates (CSP and BGA substrates), covering a full range of manufacturing services for multiple varieties, small and medium batches of fast delivery orders and large batches of orders.
product & service of IC substrate:
- CSP
Package size: 3x3mm~19x19mm - FC-CSP
Package size: 3x3mm~15x15mm - SiP
Package solution: Compatible with BGA, LGA, Flip Chip, Hybrid - FMC: Substrate thickness as low as 0.1mm
40/35um core board - PBGAs
Package size: 15x15mm~27x27mm
Shennan Circuits
Headquarters: Guangdong, China
Established time: 1984
Company website: https://www.scc.com.cn/
Shennan Circuits Co., Ltd. is a leading company in China’s printed circuit board industry and a pioneer in the field of packaging substrates in China. SCC focuses on the field of electronic interconnection, providing customers with one-stop electronic circuit technology and solutions from design, manufacturing to electronic assembly, micro-assembly and testing.
Since its establishment, SCC has always been committed to becoming a world-class electronic circuit technology and solution integrator. The company provides customers with solutions including high-speed and large-capacity, RF microwave, IC packaging substrates, etc. and other product technologies including PCB, PCBA, SUB , SIP.
About IC substrate:
Flip-chip packaging substrates
ACCESS
Headquarters: Guangdong, China
Established time: 2006
Company website: https://www.access-substrates.com/
Zhuhai ACCESS Semiconductor Co., LTD. (ACCESS) is one of the earliest companies in China to produce IC packaging substrates. It is mainly engaged in the research, development, production and sales of rigid organic IC coreless packaging substrates. Since its establishment in 2006, ACCESS has always been committed to becoming an international leading provider of innovative semiconductor packaging substrate solutions.
ACCESS is the first high-tech enterprise in the world to use the “Copper Pillar Sequential Build-up Process” to produce coreless packaging substrates and achieve mass production. The company provides customers with packaging substrate solutions for portable terminal consumer electronics products such as mobile phones, tablet computers, and game consoles, as well as customized high-density organic coreless IC packaging substrates.
At present, the radio frequency module (RF Module) packaging substrate mainly developed and produced by the company in the field of analog chip packaging has achieved mass production and successfully entered the supply chain of iPhone, Samsung Galaxy series and other smart phones, as well as iPad, Galaxy Tab and other tablet computers.
About IC Substrate:
- SiP package substrate
- FCBGA (Flip-Chip Ball Grid Array) Package Substrate
- Embedded Package Substrate/Module
Kinwong
Headquarters: Guangdong, China
Established time: 1993
Company website: https://www.kinwong.com/
Suntak
Headquarters: Guangdong, China
Established time: 1995
Company website: www.suntakpcb.com
Suntak Technology Co., Ltd. is a professional manufacturer of circuit boards. Suntak has eight high-tech smart circuit board manufacturing plants in Shenzhen, Jiangmen, Zhuhai, Dalian and Suzhou.
Suntak can provide its customers with one-stop production and services such as single-sided/double-sided circuit boards, high-layer circuit boards, HDI, special circuit boards, flexible circuit boards, rigid-flex boards, and IC substrates. Its products are widely used Used in electronic information fields such as mobile phones, computers, automobiles, communication equipment, servers, and industrial control.
About applications and products,examples:
- Automotive:
New energy electric drive MCU: Board thickness –1.6±0.16mm
Camera module: Board thickness–RF 0.8±0.08 mm /sus 1.0±0.1mm/0.3±0.05mm
Central entertainment system: Board thickness–1.6mm - Industry Control:
Photovoltaic inverter: Board thickness–1.34±0.14mm
4+N+4 Industrial Control: Board thickness–1.1mm
Industrial control machine:Board thickness–2.36±0.2mm
BOMIN
Headquarters: Guangdong, China
Established time: 1994
Company website: http://www.bominelec.com
Bomin Electronics Co., Ltd. is a company centered on “PCB + components + solutions”, providing customers with one-stop services and solutions such as design, production, and assembly. Since its establishment in 1994, Bomin has been committed to becoming a leading high-end PCB manufacturer in China, and has provided professional services to many well-known companies through advanced research on new technologies, application development of IC products, and introduction of overall customized solutions.
Bomin Electronics Co., Ltd. is mainly engaged in high-precision printed circuit boards, including high-density interconnection (HDI), multi-layer, high-frequency, etc. Its products are widely used in communication equipment, industrial control equipment, automotive electronics, medical equipment, aerospace, etc..
Kingshine
Headquarters: Guangdong, China
Established time: 2001
Company website: www.gdkxpcb.com
Guangdong Kingshine Electronic Technology Co., Ltd. (referred to as “Kingshine Electronics”) was established in 2001. It is one of the top 100 printed circuit board manufacturers in the world, specializing in R&D, production and sales of PCB boards, thick copper boards, high-frequency/high-speed boards, metal substrates, rigid-flex boards, and IC substrates. Kingshine Electronics has 5 PCB manufacturing factories in Huizhou, Guangdong, Shenzhen and Jiujiang, Jiangxi respectively.
In 2020, Kexiang Electronics’ total sales will reach RMB 1.602 billion.
About the products and details, for example:
1. Medical electronic
Doppler layer number: 6
Board thickness: 1.2mm trace
Width/ space: 3/3mil surface
Treatment: ENIG
2. Industry & safety electronic
Screen layer number: 4
Thickness: 0.2mm trace
width/ space: 2.5/2.5mil surface
Treatment: immersion tin
CEE
Headquarters: Guangdong, China
Established time: 2000
Company website: http://www.ceepcb.com/
China Eagle Electronic Technology Inc. (CEE) is a PCB supplier integrating R&D, production, sales and service, and is one of the few IC Substrate manufacturers in China. Since its establishment, CEE has always been committed to becoming the world’s leading supplier of PCB electronic information products and services.
The company’s products mainly include MLB, HDI, FPC & FPCA, R-F, IC Substrate, And these products have been widely used in consumer electronics, network communications, automotive electronics, security and industrial control, medical health and artificial intelligence, big data and cloud computing, the Internet of Things, biometrics, smart wear, smart home, drones and other emerging fields.
About IC substrate:
- IC-01 / 02 / 03
Features:
High density, high precision, miniaturization and thinning.
Protects, secures, and supports the chip to enhance its heat conduction and heat dissipation performance and protect the chip from physical damage.
